This is an entry level position and compensation will be given accordingly.

-This is a lab hands-on position in which the candidate owns the development of electrical, analytical, and mechanical tools and methodologies to ensure strategic fault isolation and failure analysis capabilities for future microelectronic package technologies and products.

-Directly responsible for 2-3 of such tools, and interacts remotely with supplier engineers to debug, optimize, and troubleshoot them as needed, and ensures continuous improvements and breakthroughs.

-Owns proliferation of shared learning across sites.

-Maintains necessary records and reports.

-Performs other related duties as required or as directed.

The candidate should possess the below behavioral skills:

-Problem solving, out-of-box thinking.
-Communication and decision-making skills.
-Teamwork and planning/time management skills.
-Capable to deliver under pressure.
-Capability to work in ambiguous situations.
-Organization skills.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. 

Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

• Must possess a Masters Degree in Acoustics, Physics, Mechanical Engineering, Ultrasound Engineering, Acoustical Engineering, or related field with 6+ months of experience.
• 1+ years of experience with Acoustics, Ultrasound Imaging, Ultrasound /Acoustics Non-destructive Testing, Photoacoustics, Laser Ultrasound, or related topic.
• 6+ months of experience with programming (e.g. Python, LabView, C, MATLAB)

Preferred Qualifications:

• 3+ months of experience with Scanning Acoustic Microscopes and/ or acoustic signal analysis.
• 3+ months of experience with ultrasonic transducer design.
• 3+ months of experience with CAD drawing and CNC machining.
• Experience with the automation of benchtop experimental systems formed by elements such as sensors, mechanical stages, data acquisition systems, etc.

Must have the required degree or expect the required degree by May/2022.

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.