20 days old

Advanced Packing at Penang - Bump/Interposer/Wafer Level Assembly Group Leader

Intel
Hillsboro, OR 97123
  • Job Code
    JR0226455
Job Description

Disaggregation Manufacturing Organization (DMO) is responsible for enabling and ramping modular manufacturing, which is a critical capability for Intel's leadership products. The project will include 2 types of factories: Advanced Packaging and Bump/Interposer. The Bump/Interposer factory includes the following activities: Passive Interposer (PI), TSV patterning and TSV reveal (TSV- through Si Via) and C4. The Bump/Interposer/Wafer Level Assembly Group Leader will report to the Factory Manager. We have multiple positions available and will align the roles to the skills and experiences of the candidate.

The Group Leader will be responsible for but not limited to:

  • New technology process transfer and matching to ensure successful startup and ramp to high volume manufacturing (HVM).
  • Must build a proficient engineering department to run process control and tool maintenance activity.
  • Demonstrate leadership skills to enable the organization to meet expectations around safety, quality, output, and affordability.
  • The department manager must have sufficient technical knowledge to provide clear management direction for daily operations/maintenance, process engineering prioritization, yield improvement and manufacturing efficiency improvement.
  • As a member of the factory staff, will also be responsible for influencing efforts toward improving overall organizational culture and operation effectiveness.
  • The Group Leader will also be responsible for people and leadership development to grow the organizational capability and must have a proven track record in managing people and the ability to build a compelling vision and mission for the organization and get the direct leaders and employees aligned to this direction.

*This position requires an Expat assignment in Malaysia.

The ideal candidate should exhibit the following behavioral traits:

  • To be a self-starter, highly organized, and have an ability to work independently across organizations.
  • Demonstrated skills to synthesize complex problems into clear messages and proposals through presentations, as well as communicating throughout the organization and factory.
  • Skills to lead problem-solving efforts and exerting influence with other organizations and management.
  • Interpersonal and relationship building skills with peers, stakeholders, and customers.
  • Skills in leading and developing individuals, managers, and teams.
  • Skills to provide technical and tactical direction.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Qualifications listed as preferred or additional will be considered a plus factor for applicants.

Minimum Requirements:

  • Candidate must possess a Bachelor's or Master's degree in Electrical Engineering, Chemical Engineering, Mechanical Engineering, Materials Science, Physics, Optics, Chemistry, or related field of study.
  • 8+ year(s) of experience in manufacturing or engineering environment.
  • 8+ year(s) of experience in direct managing of a team 10+

Preferred qualifications:

  • Knowledge of statistics and experimental design; and the skills to apply that knowledge to tool matching, tool qualification, and process development
  • Experience in Wafer Assembly (Mold, Glass Bonding), Lithography, Dry and Wet Etch, Plating, Dielectric Thin Films, Planar, Defect Metrology to join and be part of the team
  • Problem solving skills

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.



Other Locations

US, Arizona, Phoenix;US, California, Folsom;US, New Mexico, Albuquerque


Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.



Work Model for this Role

This role will require an on-site presence.

Posted: 2022-06-06 Expires: 2022-07-07

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Advanced Packing at Penang - Bump/Interposer/Wafer Level Assembly Group Leader

Intel
Hillsboro, OR 97123

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