12 days old

Assembly NPI project lead

Phoenix, AZ 85003
  • Job Code
Job Description

Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors.

The external Packaging and Assembly Engineering team (EPAE) will play a critical role in this strategy, leveraging external assembly technologies to deliver leadership products

Seeking a project leader to manage the external New Product Introduction (NPI) at external suppliers through technical expertise demonstrating project management values.

With the key objectives to qualify Intel's products at an external supplier according to product requirements guaranteeing a stable process window to support demand with high yielding production.

The NPI technical project lead will manage the complete project along the product development cycle from sourcing decision to product qualification.

The project leader will lead a cross functional team in a global environment and is responsible to drive the team to provide all deliverables in time to meet the market window.

This position's Roles and Responsibilities will include but not limited to:

  • Responsible for optimizing of package technologies for future products in partnership with Platform Management, Product Concept Engineering and Package CoDesign Lead. Selection criteria will include relative cost, size, thickness, mechanical and thermal robustness, and electrical performance.
  • Cross-check package technology selection with procurement, manufacturing partners, and substrate suppliers to determine manufacturability and assess risk.
  • Partner with stakeholders to select substrate supplier, and substrate construction.
  • Provide support to CoDesign and layout lead as manufacturability liaison.
  • Complete FMEA with assembly suppliers to assess NPI risk.
  • Feedback any design rule violations to Package Platform owner for waiver or design rule update.
  • Ensure package designs are sufficient to meet the needs for process characterization.
  • Complete FMEA with assembly suppliers which will drive Characterization Plan requirements.
  • Complete characterization plan, including criteria for success.
  • Characterization plan could be full cornering, optimization, validation and burst ramp or could be bridge characterization based on maturity of packaging technology.
  • Realize package technology certification through TV with process cornering, optimization, and reliability stress qualification.

A successful candidate will demonstrate:

  • Knowledge of resource and budget planning
  • Knowledge of supply chain business processes
  • Knowledge of NPI development process
  • Knowledge in leading multi-cultural globally distributed teams
  • Knowledge in project management
  • Knowledge of assembly processes and substrate fabrication processes
  • Knowledge of cost modelling and impact of processes on cost structure
  • Understanding of reliability failure modes in semiconductor processing and electronic packaging, inclusive of die to package interaction failures.
  • Excellent problem solving, communication and presentation skills
  • Ability to drive results across organizational boundaries. lead and work with teams spread across different geographies


You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. This Position is not eligible for Intel immigration sponsorship

Min. qualifications:


MS in Mechanical Engineering, Materials Science, Physics, Electrical Engineering or similar degree with focus on micro-electronics, electronic package, or semiconductors.

Work Experience

5+ years experience working in Semiconductor Packaging within a technology development or new product development environment.

3+ years experience in leading global teams

3+ years experience in project management

Preferred Qualifications:

Ph.D. in Mechanical Engineering, Materials Science, Physics, Electrical Engineering or similar degree with focus on micro-electronics, electronic package, or semiconductors.

Experience working on new product introductions, in particular in assembly

Inside this Business Group

Intel's Sales and Marketing (SMG) organization works with global customers and partners to solve critical business problems with Intel based technology solutions. SMG works across business units to amplify the customer voice and deliver solutions that accelerate their business. We work across numerous industries, including retail, enterprise and government, cloud services and healthcare as examples. The operations team focuses on forecasting, driving alignment with factory production and delivering efficiency tools and our marketing capability drives demand and localized marketing in locations around the globe. Our sales force navigates a complex partner and customer ecosystem while shaping product roadmaps, driving value for our customers, and collaborating to harness emerging technology trends to deliver comprehensive solutions.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

Posted: 2022-05-15 Expires: 2022-06-15

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Assembly NPI project lead

Phoenix, AZ 85003

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