15 days old

ATTD-IFS Integration Lead

Intel
Phoenix, AZ 85003
  • Job Code
    JR0220806
Job Description

Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages. Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design. Conducts tests and research on basic materials and properties. Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance. Provides consultation concerning packaging problems and improvements in the packaging process. Responds to customer/client requests or events as they occur. Develops solutions to problems utilizing formal education and judgment.

This is an opportunity to be part of a critical team chartered to deliver Industry leading solutions to enable IDM 2.0.

  • Responsible for delighting IFS customers by driving their package, assembly and test projects through completion.
  • Be a voice for IFS customers within Intel and drive assembly and test road maps to meet their requirements.
  • Drive internal assembly and test for enabling CEOs vision for IDM 2.0
  • Establish material specifications for contract assemblies and raw material vendors and interface with Quality Assurance and Purchasing regarding material quality and vendor performance
  • Respond to customer/client requests and issues when they occur and work with stake holders to deliver solutions that delight our customers.
  • Partner with Intel factories and other stake holders to ensure delivering projects with an objective of delighting Intel's customers


Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

  • Bachelors degree in engineering or a related field
  • 10 years of microelectronics packaging experience driving critical projects for customers
  • Experience with OSAT assembly houses


Preferred Qualifications:

  • Experience with directly interacting with customers to deliver critical projects in high volume
  • Ability to manage multiple critical customer interactions

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.


Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.



Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

Posted: 2022-05-08 Expires: 2022-06-08

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ATTD-IFS Integration Lead

Intel
Phoenix, AZ 85003

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