12 days old

Chip Attach Module and Hybrid Chip Attach Module Engineer On Day Shift

Intel
Phoenix, AZ 85003
  • Job Code
    JR0211136
Job Description

Assembly and Test Technology Development (ATTD) Microelectronic Packaging Engineers provide project management package design and/or development and sustaining support for integrated circuit or semiconductor assemblies various other electronic components and/or completed units.

Additionally, will be expected to:

  • Be responsible for the thermal /mechanical/electrical design analysis and development of electronic packages.
  • Define overall package performance and specification and realize technology certification through layout design and test vehicle design.
  • Conduct tests and research on basic materials and properties.
  • Establish material specifications for contract assemblers and raw material vendors and interface with Quality Assurance and Purchasing regarding material quality and vendor performance.
  • Provide consultation concerning packaging problems and improvements in the packaging process.
  • Respond to customer and/or client requests or events as they occur.
  • Develop solutions to problems utilizing formal education and judgment.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.

Minimum Qualifications

  • Possess a bachelor of science degree (BS degree) with 3+ years of experience or master's degree with 2+ years of experience in Electrical or Mechanical Engineering or Chemical Engineering or relevant field.

Preferred Qualifications

2+ years of experience with the following:

  • Integrated Technical Problem Solving with Factory Equipment Assembly Material Sets and Key Process Parameters (KPP)
  • Statistical Process Control (SPC)/Design of Experiments (DOE) principles used for Technical Problem Solving
  • Sustaining Semiconductor Process Steps in dynamic Operations Environment


3+ years of experience with the following:

  • Engineering position supporting MFG on a technical role with Equipment or Process Development tasks experience.
  • Engineering Sustaining position supporting MFG on Integrated Technical Problem Solving with Factory Equipment Assembly Material Sets and Key Process Parameters (KPP)

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.


Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.



Work Model for this Role

This role will require an on-site presence.

Posted: 2022-05-14 Expires: 2022-06-14

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Chip Attach Module and Hybrid Chip Attach Module Engineer On Day Shift

Intel
Phoenix, AZ 85003

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