Assembly and Test Technology Development (ATTD) Chip Attach Module (CAM) Pathfinding Engineer will be expected to assess and define strategies to bring new capabilities needed for next generation advanced packaging of Intel's products.

Responsibilities will include, but not be limited to:

• Leading the selection of new packaging technologies (First-of-a-kind), Owning process definition, process modeling, and program management and transferring process to Development Teams.
• Develop advanced packaging acumen applying principles of design of experiments and data analysis.
• Defining strategies to drive solutions to a wide range of theoretical and practical problems, which require a high degree of innovation and ingenuity.
• Conducts tests and research on basic materials and properties.
• Provides consultation concerning packaging problems and improvements in the packaging process.
• Develops solutions to problems utilizing formal education and judgment.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.

Minimum Qualifications

• Possess a bachelor's degree with 6+ years experience or master's degree with 3+ years of relevant experience or PhD degree with 1+ years of relevant experience in Mechanical Engineering or Material Science Engineering or Chemical Engineering or Electrical Engineering or Physics or Chemistry or Optical Engineering or Polymer Science and Engineering or related field.

Preferred Qualifications

• Possess a master's degree with 5+ years of relevant experience or PhD degree with 3+ years of relevant experience in Mechanical Engineering or Material Science Engineering or Chemical Engineering or Electrical Engineering or Physics or Chemistry or Optical Engineering or Polymer Science and Engineering or related field.

6+ years of experience (bachelor's) or 3+ years of experience (master's) or 1+ years of experience (PhD) with one or more of the following:

• Process technology development or demonstrated technical innovation
• Semiconductor fabrication processes and technology
• Project Management experience with external Vendors
• Process modeling

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.