11 days old

Die Prep Process Engineer

Hillsboro, OR 97123
  • Job Code
Job Description

As the Process Engineer, you will be responsible for but not limited to: 

  • Developing and sustaining such processes as Thinning, Mount, and Wafer Handling in semiconductor Die Prep manufacturing operations.
  • Planning and implementing capacity, and operational improvements to maximize output while improving the safety and quality of operations.
  • Conducting tests and measurements of their operations to determine control over critical dimensions and defectivity of the process line.
  • Recommending and implementing modifications for operating the equipment in order to improve production efficiencies, and manufacturing techniques, and optimize production output for existing products.
  • Establishing and submitting processing requirements to be met in designing and acquiring processing equipment.
  • Exercising independent judgment and discretion by making recommendations and adjusting tools and processes reactively when something has changed on the line or proactively in order to maximize output.
  • Developing solutions to problems utilizing formal education and judgment.


This is an entry-level position and will be compensated accordingly.

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research, and relevant previous job and/or internship experience.

This position is not eligible for Intel immigration sponsorship.

Minimum Qualifications:


  • The candidate must possess a Bachelor's or Master's degree in Mechanical Engineering, Physics, Chemistry, Electrical Engineering, Chemical Engineering, Material Science, Material Engineering, or related field of study.

Preferred Qualifications:

  •  Manufacturing or assembly experience.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

Posted: 2022-05-16 Expires: 2022-06-17

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Die Prep Process Engineer

Hillsboro, OR 97123

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