22 days old

DRAM Packaging Engineer

Apple, Inc.
Cupertino, CA 95014
  • Job Code


Posted: May 28, 2019

Role Number: 200062686

Envision what you could do here. At Apple, we believe new ideas have a way of becoming extraordinary products, services, and cust...Summary


Posted: May 28, 2019

Role Number: 200062686

Envision what you could do here. At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. As a member of our dynamic group, you will have the rare and rewarding opportunity to craft upcoming products that will delight, and inspire millions of Apple's customers every single day.


Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for perfection to work towards an extraordinary result? We are looking for a hardworking and passionate DRAM Packaging Engineer to join our team.

SEG Packaging is a key part of the HW Technologies team, and is located in Cupertino, CA. This team invents, designs, develops and integrates electronic packaging solutions for the Apple's internal and customized external components of hardware for its consumer electronic products.

As a DRAM packaging engineer, you will lead the memory package development by handling the external memory vendors and steering their packaging design compatibility to Apple system components. You will partner with the internal SEG teams, defining the memory package architecture, die pad layout, package form factor, interconnect and package density, and will support the overall system level architecture, product teams and overall program through the development and NPI cycle.

Key Qualifications

  • Working knowledge in Si circuit/DRAM cell design and package design for mobile memory products : LPDRAM, etc
  • Experience in Assembly process development for mobile DRAM/MCP memory
  • Packaging Materials working knowledge
  • Very good understanding and knowledge in memory SIPI, layout trade-offs
  • Expert in packaging substrate and assembly process technology, test and reliability
  • Excellent engineering problem solving skills, with strong engineering physics
  • Strong written and verbal communication skills


Define the memory package POR (plan of record): Package architecture, technology, process, form factor, layout, bill of materials (BOM), design rules, thermo-mechanical, signal integrity, power integrity
Publish internal package specs for customized memory
Drive next generation memory Silicon & package architecture and technology roadmap
Close partnership with multiple internal teams in HW technologies group supporting weekly and monthly memory technology reviews
Establish trusting and reciprocal relationship and communication channels, as a direct interface with vendors for DRAM memory package development and qualification
Review, drive and approve the DRAM memory vendors DOEs/characterization plans, technology and product qualification and data for package development
Drive industry with advanced package processes, new materials and leading edge specifications
About 10% international travel required

Education & Experience

PhD preferred with plus 3-6 years experience or MSc (EE, Chemical Engineering, ME, Materials Science/Engineering major) with plus 7-10 years of experience as integration in DRAM memory package and/or memory product development

Posted: 2020-03-07 Expires: 2020-04-06

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DRAM Packaging Engineer

Apple, Inc.
Cupertino, CA 95014

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