As the Engineer Technician, you will be responsible for but not limited to: 

• TEM lamellae preparation (TEM prep) and/or physical failure analysis (PFA) of packaged or unpackaged semiconductor product or test chip units in support of root cause analysis of reliability fails.

• Working and completing jobs in TEM prep and/or PFA queue in order of priority.

• Assisting engineering in the assessment of defect isolation and identification.

• Organizing work to ensure accomplishment of all assigned tasks including documentation and communication.

• Working from technical documents, design layout, written BKMs, and verbal directions to complete tasks in assigned areas.

• Knowledge of TEM prep and/or delayering/ de-processing techniques including but not limited to: polishing, dimpling, CNC milling, wet and dry etch, Focus Ion Beam (FIB) operation, FIB assisted depositions/ etching, SEM inspection, TEM prep, and other PFA techniques.

• Knowledge of a wide array of laboratory techniques and skills due to assignments being semi-routine.

• Basic training will be provided on the job as required in necessary competencies like electron microscopy.

The ideal candidate should exhibit the following behavioral traits:

• Attention to detail.

• Focus to execute.

• Willingness to learn new techniques.

• Documentation, oral and written communication skills.

• Willingness to receive general instructions on tasks and judgment is required often to resolve nonstandard problems.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience.

This is an entry level position and will be compensated accordingly. This position is not eligible for Intel immigration sponsorship.

Minimum Qualifications:
The candidate must possess at least one of the following degree(s) plus the years of experience determined for each of the areas specified below:

• Associate's degree in Materials Science, Physics, Chemistry or any Engineering field or a related field of study.

-OR-

• Technical certification in a STEM related discipline.

Preferred Qualifications:

• Hands-on electron microscopy know-how.

• TEM prep or failure analysis knowledge.

• Mechanical grinding polishing dimpling and or wet and/or dry etching.

• IC processing and analytical laboratory techniques.

• 1+ years of failure analysis lab experience.

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.