The Low Yield Analysis (LYA) Engineering Technician will perform Low Yield Analysis focused on defect and process characterization with the objective of driving yield improvement across Assembly and Test Technology Developments (ATTDs) portfolio of packaging technologies. As an LYA analyst, the successful candidate will leverage a wide range of failure analysis and LYA techniques, summarize key LYA data and share the results with stakeholders.

The candidate will also ensure an inclusive and collaborative work environment.

Responsibilities will include:

-Assembly defect and or process characterization and assisting in identifying key mechanisms that contribute to root cause identification.

-Conduct hands on lab work to help define root cause of defects and assist in recommending corrective actions and or fixes to internal customers.

-Attend and present data and/or findings in LYA team meetings as well as with external partners.

-Respond to customers' requests or events as they occur.

-Additionally in this role, assignments are varied in nature and require a technical understanding of the assembly and substrate manufacturing disciplines.

-Some degree of judgment is required in resolving non-standard problems.

Candidates will work closely with engineers in a collaborative environment.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. 

Minimum Qualifications:

• Candidate must possess an Associate's Degree with 3+ years of experience or Bachelor's Degree in a relevant STEM Science or Technology or Engineering or Mathematics field.
• 1+ year of experience in a laboratory setting and experience with electron microscopy and/or DIB (Dual Ion Beam) techniques.

Preferred Qualifications:

• Associate's or Bachelor's degree in Materials Science, Engineering, Chemistry, or Chemical Engineering.
• 3+ years prior experience with Dual Ion Beam technique.
• 1+ year prior experience with cross sectional techniques such as mechanical polish, ion milling.
• 1+ year prior experience with electron microscopy.

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.