29 days old

Foundry product Chip/Package integration engineer

Hillsboro, OR 97123
  • Job Code
Job Description

This job is to work with external silicon foundry and assembly suppliers and Intel bump and assembly organizations to enable Intel outsourced products manufacturing to the most advanced process technologies. The work scope covers new products' Si and bump interactions and chip package integration during both new product introduction (NPI) engineering and risk production ramping including technical program management. It is a job giving you opportunities to be involved in the semiconductor industry ecosystem and directly work with Intel business units for Intel's market expansion.
The Foundry product Chip/Package Integration engineer will be responsible for but not limited to:
Lead advanced technology Si/package related programs responsible for interfacing with assembly counter partners and driving foundry suppliers to improve fab process and enable chip Package integration (CPI).
Build effective relationships with foundry and assembly suppliers and Intel bump and assembly technology organizations.
Understand advanced Si fab backend process, bump process and package process, and help product engineers to resolve various of Si interaction issues with Bump or package.
Perform various in-depth analysis of fab process related chip/package interaction issues and drive for solutions.
Conduct design of experiments (DOE) to validate and qualify Si backend process improvements.
Lead Task Forces or working groups for backend process related activities.
The ideal candidate should exhibit the following behavioral traits:
Excellent communication capability and presentation skills
Strong leadership to lead NPI team CPI activitie

Sufficient influence capability to rep Si product teams to assembly world.
Rich knowledge and experience on advanced technology backend process, bump process and Si/package integration.
Program management experience


You must possess the below minimum qualifications to be initially considered for this position. Qualifications listed as preferred or additional will be considered a plus factor for applicants.
Minimum Qualifications:
Candidate must possess a Master's degree or Ph.D. in Electrical Engineering, Materials Science and Engineering, Physics, mechanical or chemical engineering, or equivalent STEM degree.
10+ years of working experience in advanced backend or bump process development and Chip Package integration.
5+ years of experience in leading technical programs and cross functional teams.

Preferred Qualifications:
5+ years of experience with key process modules of bumping and assembly and relevant key materials, epoxy, substrate, and mold compound, etc. will be advantage.
Direct hands-on experiences and knowledge to bumping and advanced packages/Chip integration are preferred.

Inside this Business Group

Intel's Sales and Marketing (SMG) organization works with global customers and partners to solve critical business problems with Intel based technology solutions. SMG works across business units to amplify the customer voice and deliver solutions that accelerate their business. We work across numerous industries, including retail, enterprise and government, cloud services and healthcare as examples. The operations team focuses on forecasting, driving alignment with factory production and delivering efficiency tools and our marketing capability drives demand and localized marketing in locations around the globe. Our sales force navigates a complex partner and customer ecosystem while shaping product roadmaps, driving value for our customers, and collaborating to harness emerging technology trends to deliver comprehensive solutions.

Other Locations

US, California, Santa Clara

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

Posted: 2022-07-12 Expires: 2022-08-12

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Foundry product Chip/Package integration engineer

Hillsboro, OR 97123

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