27 days old

Hardware Technology - Integrated Circuit Packaging Simulation Intern

Cleveland, OH 44114
  • Job Code
    200204830
Summary

Summary

Posted: Apr 8, 2021

Weekly Hours: 40

Role Number:200204830

Home Office: Yes

Imagine what you could do here. At Apple, new ideas have a way of becoming extraordinary prod...Summary

Summary

Posted: Apr 8, 2021

Weekly Hours: 40

Role Number:200204830

Home Office: Yes

Imagine what you could do here. At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Dynamic, smart people and inspiring, innovative technologies are the norm here. The people who work here have reinvented entire industries with all Apple Hardware products. The same passion for innovation that goes into our products also applies to our practices strengthening our commitment to leave the world better than we found it. Join us to help deliver the next groundbreaking Apple product. Do you love working on challenges that no one has solved yet? As a member of our dynamic group, you will have the unique and rewarding opportunity to craft upcoming products that will delight and inspire millions of Apple's customers every single day.

Integrated Circuit (IC) is the brain of modern electronics. IC Packages are the mechanical and electrical interfaces of ICs and the environment. IC Packaging is truly a challenging multidisciplinary field that attracts some of the top talents in the industry.

As an IC Packaging Intern in Apple, you will work on characterizing IC packages and simulating package deformation and stress under different testing conditions. You will also be involved in developing characterization methodologies of materials used in IC packaging and automating model generation for stress simulation.

Key Qualifications

  • Good training in solid mechanics, mathematics, computer programming.
  • Hands-on experience of major mechanical design CAD tools (e.g., NX, AutoCAD, SpaceClaim, SolidWorks)
  • Hands-on experience of major Finite Element Method (FEM) tools (e.g., ANSYS, ABAQUS, Hypermesh) and numerical simulation tools (e.g., MATLAB, Scientific Python).
  • Excellent written and verbal communication skills. Able to present ideas, data and plans with high confidence at team meetings.

Description
- Simulating deformation and stress of IC packages under various testing conditions.
- Developing methodologies of automating FEM model generation.
- Characterizing materials for model inputs.
- Validating simulation results by measurements.

Education & Experience

In a program towards a PhD degree in Mechanical Engineering, Engineering Mechanics, Materials Science, Physics or related fields.

You are additionally required to return to school after the internship to continue or complete your education, or an internship needs to be required for graduation from your school. You also qualify if accepted into a graduate program after graduation.

Additional Requirements

Posted: 2021-03-20 Expires: 2021-04-19

Before you go...

Our free job seeker tools include alerts for new jobs, saving your favorites, optimized job matching, and more! Just enter your email below.

Share this job:

Hardware Technology - Integrated Circuit Packaging Simulation Intern

Apple, Inc.
Cleveland, OH 44114

Join us to start saving your Favorite Jobs!

Sign In Create Account
Powered ByCareerCast