2 days old

IC Package/System Design Engineer

Intel
Hillsboro, OR 97123
  • Job Code
    JR0208426
Job Description

As an integral part of Intel's new IDM2.0 strategy, we establish Intel Foundry Services (IFS), a fully vertical, standalone foundry business, reporting directly to Intel's CEO. IFS will be a world-class foundry business and a major US and European-based capacity provider to serve customers globally. We differentiate IFS with a combination of leading-edge packaging and process technology, committed capacity in the US and Europe, plus a world-class IP portfolio including x86 cores, graphics, media, display, AI, interconnect, fabric, and other critical foundational IP, along with Arm and RISC-V ecosystem IPs.


IFS will also provide access to silicon design services to help our customers seamlessly turn silicon into solutions using industry-standard design packages. Intel dedicates IFS to the success of its customers with entire Profit and Loss responsibilities. This model will ensure that our foundry customers' products will receive our utmost focus in terms of service, technology enablement, and capacity commitments. IFS is already engaged with customers today, starting with our existing foundry offerings. We are expanding imminently to include our most advanced technologies optimized for cutting-edge performance, making them ideal for high-performance applications.

This position is with the Advanced Systems Pathfinding team within the Customer Solutions Engineering group in IFS. The Systems Pathfinding team focuses on new technologies on the horizon which are relevant to the success of IFS. Within this team, we have capabilities of rapid prototyping of FPGA-centric platforms to develop and enable adoption of IFS products. This area is rich for innovation and invention. You will work on cutting-edge projects and prototypes of future SoC systems while helping drive new technologies critical to Intel and IFS success.


This role will focus on package design, including mechanical and thermal design aspects. In this role, you will collaborate with Principal Engineers, Architects, and ASIC design leads to come up with new packaging solutions. You must be able to handle uncertainty and ambiguity in requirements and support feasibility studies for various package options and evaluate designs for manufacturability and reliability. You will work on packaging IP development and provide design support forthermal/mechanical/electrical simulation analysis. For this position growth mindset and innovative thinking skills are a must. Prior experience of invention and innovation is strongly required.

We are looking for someone with strong communications skills, who is an independent worker and has experience handling several projects at the same time. We need someone who can work with multiple teams.

More broadly, Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components, and/or completed units. Responsible for thethermal/mechanical/electrical design, analysis, and development of electronic packages. Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design. Conducts tests and research on basic materials and properties. Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance. Provides consultation concerning packaging problems and improvements in the packaging process. Responds to customer/client requests or events as they occur. Develops solutions to problems utilizing formal education and judgment.


This position is not eligible for Intel immigration sponsorship.


Qualifications

Minimum Qualifications:


Master's Degree in Electrical Engineering / Computer Engineering or relevant field with 7+ years of industry experience in IC package design.

Other experience includes

  • Die to die interconnect technologies
  • Chiplet integration technologies
  • TSV interposers
  • 1D, 2D, 3D packaging solutions
  • Controller and/or Advanced Memory Substrate Design
  • Signal/Power Integrity Analysis/Optimization
  • Cadence and AutoCAD tools
  • Assembly Process/Materials


Preferred Qualifications:

  • PhD in electrical engineering or related field
  • Experience with EMIB and FOVEROS preferred


Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Inside this Business Group

As an integral part of Intel's new IDM2.0 strategy, we establish Intel Foundry Services (IFS), a fully vertical, standalone foundry business, reporting directly to Intel's CEO. IFS will be a world-class foundry business and a major US and European-based capacity provider to serve customers globally. We differentiate IFS with a combination of leading-edge packaging and process technology, committed capacity in the US and Europe, plus a world-class IP portfolio including x86 cores, graphics, media, display, AI, interconnect, fabric, and other critical foundational IP, along with Arm and RISC-V ecosystem IPs. IFS will also provide access to silicon design services to help our customers seamlessly turn silicon into solutions using industry-standard design packages. Intel dedicates IFS to the success of its customers with entire Profit and Loss responsibilities. This model will ensure that our foundry customers' products will receive our utmost focus in terms of service, technology enablement, and capacity commitments. IFS is already engaged with customers today, starting with our existing foundry offerings. We are expanding imminently to include our most advanced technologies optimized for cutting-edge performance, making them ideal for high-performance applications.


Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.



Work Model for this Role

This role is available as fully home-based and generally would require you to attend Intel sites only occasionally based on business need.

Posted: 2022-05-23 Expires: 2022-06-24

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IC Package/System Design Engineer

Intel
Hillsboro, OR 97123

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