About the Group:

As an integral part of Intel's new IDM2.0 strategy, we are establishing Intel Foundry Services (IFS), a fully vertical, standalone foundry business, reporting directly to the CEO. IFS will be a world-class foundry business and major provider of US and European-based capacity to serve customers globally. Intel Foundry Services will be differentiated from other Foundry offerings with a combination of leading-edge packaging and process technology, committed capacity in the US and Europe - available for customers globally - and a world-class IP portfolio that customers can choose from including x86 cores, graphics, media, display, AI, interconnect, fabric and other critical foundational IP, along with Arm and RISC-V ecosystem IPs. IFS will also provide access to silicon design services to help our customers seamlessly turn silicon into solutions, using industry standard design packages. This business unit is completely dedicated to the success of its customers with full P and L responsibilities. This model will ensure that our foundry customers' products will receive our utmost focus in terms of service, technology enablement and capacity commitments. IFS is already engaged with customers today starting with our existing foundry offerings and we are expanding imminently to include our most advanced technologies, which are optimized for cutting-edge performance, making them ideal for high-performance applications.

About the Role:

The selected candidate for the Foundry Technology Engineer will be responsible for, but not limited to:

• Defines roadmaps to meet requirements, goals and milestones for all foundry technology process.

• Definition and optimization of process design rules for technology development use.

• Collaborate with organization partners to ensure the highest-quality Process Design Kit (PDK) technology collaterals and support design usage.

• Support product development on process definition, IP and product design execution, modeling and design rules, tapein acceptance, mask tapeout, and wafer manufacturing.

• Collaborating with ecosystem to motivate development of enabling design tools for heterogeneous integration and partner on reduction to practice.

• Collaborating with customers to develop, pilot, and deploy improvements of design frameworks.

• Incorporating industry-standard tooling to successfully navigate trade-offs between power, performance, area, and cost at the system and chiplet level.

The ideal candidate should exhibit the following behavioral traits:

• Service mindset with a focus on solution velocity thrives in solving complex and cross-functional problems

• Skills with ecosystem partnership collaborations

Qualifications

Minimum qualifications are required to be initially considered for this position.

Minimum:

The candidate must possess at least one of the 3 following degrees plus the years of experience determined for each degree in the areas of expertise specified below:

• Bachelor's degree in Electrical Engineering, Materials Science, Chemical Engineering, Chemistry, Physics, Mechanical Engineering, or related field with 12+ years of experience.

• Master's degree in Electrical Engineering, Materials Science, Chemical Engineering, Chemistry, Physics, Mechanical Engineering, or related field with 10+ years of experience.

• Ph.D. in Electrical Engineering, Materials Science, Chemical Engineering, Chemistry, Physics, Mechanical Engineering, or related field with 5+ years of experience.

Expertise areas:

• Expertise in wafer process techniques along with deep understanding of integrated interaction between them.

• Detailed understanding of device and interconnect physics, properties, and characterization methodology.

• Expertise and experience in understanding why certain process design rules are in place, how they interact with each other, and benefits of compliance and penalties of violating them.

• Broad expertise with challenges and options for device and interconnect definition and manufacturing processes along with familiarity in fab operating systems for data pull and reviews including electrical testing and various metrology techniques and systems.

• Knowledge of technology features and impact to product cost tradeoffs

• Service mindset with a focus on solution velocity, and thrives in solving complex and cross-functional problems.

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Other Locations

US, Arizona, Phoenix;US, California, Folsom;US, Oregon, Hillsboro;US, Texas, Austin

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.