Die Prep and Wafer Level Assembly processing and packaging technologies is one of Intel's key growth areas and there are a lot of exciting growth opportunities available in the Oregon assembly and technology Integration (OATI) department.

The position is for an integration technician in OATI. Role involves supporting engineering experimental design activities through integrated lot set ups, data analysis functions and helping assisting with research activities, lot plan management, project management of new product. Introduction NPI Readiness Work with partner organizations including lab teams planning, manufacturing QR and module engineering on a regular basis to meet the development goals, establish baseline process flows, manage test vehicle, build plans and coordinate with module engineering to forecast and execute experiments as well as lab work for analysis of experiments.

Additionally in this role:

Assignments are semi routine in nature. Work performed within generally defined parameters. Normally receives general instructions on requirements and expectations.

Candidate must be willing to:

• Work in a clean room environment wearing coveralls, hoods, booties, safety glasses, and gloves when needed.

• Work in hands on situations and ambiguous situations.

Candidate must exhibit the following behavioral traits/skills:

• Excellent communication adept and presentation skills.

• Plan and adapt to changing priorities.

• Work in a team.

• Technical problem solving skills.

• Judgment skills are required in resolving nonstandard problems.

• Initiative and time management skills.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

Candidate must possess an associate's degree in an engineering or science related discipline.

OR

Mechanical Technical Certification with 3+years of experience.

• 1+ years of experience in MES300 systems.

Preferred Qualifications:

• 3+ years experience in assembly test planning or configuration management.

• Statistics and analytical lab skills ex TSAM CSAM.

• Cross-sections mechanical measurements etc.

• Proficiency in Microsoft Office Excel and PowerPoint.

• Demonstrated knowledge in ASIPRE, SPEED, and MES.

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.