13 jobs with job title Packager at Intel - Hillsboro, Oregon, United States

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30 days old

Advanced Packaging Research and Development Supply Chain Engineer

Intel
Hillsboro, OR US
Job DescriptionThe ideal candidate will have experience in semiconductor advanced packaging technologies, be capable of independently assessing the merits and demerits of those solutions and recommend the ideal supplier development partner, while we strive to maintain good work/life balance.As the A...
Job DescriptionThe ideal candidate will have experience in semiconductor advanced packaging technologies, be capable of independently assessing...
26 days old

Advanced Packaging at Penang - Dry Etch Department Manager

Intel
Hillsboro, OR US
Job DescriptionDisaggregation Manufacturing Organization (DMO) is responsible for enabling and ramping modular manufacturing, which is a critical capability for Intel's leadership products. The project will include 2 types of factories: Advanced Packaging and Bump/Interposer. The Bump/Interposer fac...
Job DescriptionDisaggregation Manufacturing Organization (DMO) is responsible for enabling and ramping modular manufacturing, which is a critical...
26 days old

Advanced Packaging at Penang - Planar Department Manager

Intel
Hillsboro, OR US
Job DescriptionDisaggregation Manufacturing Organization (DMO) is responsible for enabling and ramping modular manufacturing, which is a critical capability for Intel's leadership products. The project will include 2 types of factories: Advanced Packaging and Bump/Interposer. The Bump/Interposer fac...
Job DescriptionDisaggregation Manufacturing Organization (DMO) is responsible for enabling and ramping modular manufacturing, which is a critical...
26 days old

Advanced Packaging at Penang - Photolithography Department Manager

Intel
Hillsboro, OR US
Job DescriptionDisaggregation Manufacturing Organization (DMO) is responsible for enabling and ramping modular manufacturing, which is a critical capability for Intel's leadership products. The project will include 2 types of factories: Advanced Packaging and Bump/Interposer. The Bump/Interposer fac...
Job DescriptionDisaggregation Manufacturing Organization (DMO) is responsible for enabling and ramping modular manufacturing, which is a critical...
18 days old

Packaging Chemical Mechanical Polishing Research and Development Engineer

Intel
Hillsboro, OR US
Job DescriptionAssembly Test and Technology Development (ATTD) is looking for a Microelectronic Packaging Engineers. Some of the responsabilities will be:-Provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other ...
Job DescriptionAssembly Test and Technology Development (ATTD) is looking for a Microelectronic Packaging Engineers. Some of the responsabilities...
25 days old

Packaging Research and Development Engineer

Intel
Hillsboro, OR US
Job DescriptionPosition is for a Technologist in the Assembly and Test Technology Development (ATTD0 organization in the area of electronic packaging/assembly related tools and methods to support various initiatives to drive heterogenous integration and sustain Moores law. The candidate will be part...
Job DescriptionPosition is for a Technologist in the Assembly and Test Technology Development (ATTD0 organization in the area of...
22 days old

Packaging Technology Development Chemical Mechanical Polishing Staff Engineer

Intel
Hillsboro, OR US
Job DescriptionJoin WATD to make a change and make an impact on the world.Wafer level assembly Technology Development (WATD) is the TD org in ATTD that focus on developing next gen packaging technologies. WATD is in the midst of an exciting transformation, with a vision to create and extend packagin...
Job DescriptionJoin WATD to make a change and make an impact on the world.Wafer level assembly Technology Development (WATD) is the TD org in ATTD...
20 days old

Microelectronic Packaging Research and Development Engineer, Night Shift

Intel
Hillsboro, OR US
Job DescriptionMicroelectronic Packaging Research and Development (R&D) Engineers with the Wafer Assembly Technology Development (WATD) team, provide on shift sustaining support for integrated circuit or semiconductor processes, project collaboration, and package design/development process feedb...
Job DescriptionMicroelectronic Packaging Research and Development (R&D) Engineers with the Wafer Assembly Technology Development (WATD) team,...
20 days old

Microelectronic Packaging Research and Development Engineer, Day Shift

Intel
Hillsboro, OR US
Job DescriptionMicroelectronic Packaging Research and Development (R&D) Engineers with the Wafer Assembly Technology Development (WATD) team, provide on shift sustaining support for integrated circuit or semiconductor processes, project collaboration, and package design/development process feedb...
Job DescriptionMicroelectronic Packaging Research and Development (R&D) Engineers with the Wafer Assembly Technology Development (WATD) team,...
10 days old

Microelectronic Packaging Research and Development Engineer - WATD

Intel
Hillsboro, OR US
Job DescriptionWafer Assembly Technology Development (WATD) Microelectronic Packaging Engineers in Assembly and Test Technology Development (ATTD) provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electroni...
Job DescriptionWafer Assembly Technology Development (WATD) Microelectronic Packaging Engineers in Assembly and Test Technology Development...
9 days old

Packaging Chemical Mechanical Polishing Research and Development Engineer

Intel
Hillsboro, OR US
Job DescriptionWafer Assembly Technology Development (WATD) is a department of Assembly and Test Technology Development (ATTD) which owns developing die prep and wafer level packaging process Technology Development Engineers focused on developing process equipment capabilities needed for next genera...
Job DescriptionWafer Assembly Technology Development (WATD) is a department of Assembly and Test Technology Development (ATTD) which owns...
5 days old

Microelectronic Packaging Research and Development Engineer - WATD

Intel
Hillsboro, OR US
Job DescriptionWafer Assembly Technology Development (WATD) Microelectronic Packaging Engineers in Assembly Test and Technology Development (ATTD) will be responsible for, but are not limited to:Project management package design/development and sustaining support for integrated circuit or semiconduc...
Job DescriptionWafer Assembly Technology Development (WATD) Microelectronic Packaging Engineers in Assembly Test and Technology Development (ATTD)...
5 days old

Advanced Packaging Research and Development Supply Chain Engineer

Intel
Hillsboro, OR US
Job DescriptionThe ideal candidate will have interest and background in semiconductor metrology and inspection technologies, be capable of independently assessing the merits and demerits of those solutions and recommend the ideal supplier development partner, while we strive to maintain good work/li...
Job DescriptionThe ideal candidate will have interest and background in semiconductor metrology and inspection technologies, be capable of...

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