Summary

Posted: Jan 28, 2021

Weekly Hours: 40

Role Number:200213065

The candidate will work with Apple's innovative Reliability Engineering team working with hardware development ...Summary

Summary

Posted: Jan 28, 2021

Weekly Hours: 40

Role Number:200213065

The candidate will work with Apple's innovative Reliability Engineering team working with hardware development and Silicon packaging team. The engineer will be responsible for leading the board level package integration reliability tests on new Mac Apple Soc Package and similar technologies, development of new test procedures to quantify the reliability of a design, and failure analysis resulting from these tests.

Key Qualifications

• Knowledge of Semiconductor package integration, SLI (Second level Interconnect) reliability, Bonding materials, Warpage control.
• Experience performing board level reliability testing including Mechanical Stress Tests, Shock/Drop/Vibration Testing, Environmental Testing
• Failure Analysis analytical techniques (Optical Microscopy, X-Ray, SEM/EDS, FTIR, XPS etc)
• Ability to use fundamental failure analysis methodology to derive a root cause of failure
• Knowledge of failure modes and statistical life data analysis using curve fitting and distributions models.
• Knowledge of industry test Standards (JEDEC, ASTM, IEEE)
• Application of DOE (design of Experiments)
• Application of FMEA (Failure Modes an Effects Analysis)
• Exceptional problem solving abilities
• Excellent written and verbal communication skills
• Strong attention to detail
• Ability to manage multiple projects at the same time
• Dynamic and "can do" attitude with a desire to work with a great team and product

Education & Experience
MS or PhD in Materials Science, Mechanical Engineering or an equivalent field desired
Consumer electronics experience is preferred

Additional Requirements