16 days old

Oregon Wafer Level Assembly Process Engineer

Intel
Hillsboro, OR 97123
  • Job Code
    JR0221507
Job Description

You will be a member of the Oregon Wafer Level Assembly (OWLA) organization at Intel's Ronler Acres campus. This new Wafer Level Assembly process is an integral part of Intel's Foveros technology.

As a Wafer Level Assembly engineer, you will be responsible for all aspects of your assigned module including safety, quality, output, cost of operation, and labor productivity. The scope of work and responsibilities of a Oregon WLA engineer are very similar to those of a fab module engineer. You will be expected to:

  • Sustain the day-to-day operations of your area by responding to, containing, and dispositioning safety and quality concerns, addressing down tools, and implementing solutions to prevent repeat incidents.
  • Continuously improve your area by proactively identifying and implementing safety and ergonomic improvements, excursion prevention measures, methods to increase tool utilization, and reduce cost.
  • Coordinate these efforts with our development partners in Oregon.

This is an entry level position and will be compensated accordingly.


Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications:

  • Candidate must possess a Bachelors or Masters degree in an Engineering and/or Science discipline such as Physics, Applied Physics, Chemistry, Materials Science, Chemical Engineering, Mechanical Engineering, or Electrical Engineering.

Preferred Qualifications:

  • 0-1+ years in semiconductor industry experience via graduate research, internship, or prior employment.
  • 0-1+ years in statistical process control techniques, data analysis, and model-based problem solving.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.


Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.



Work Model for this Role

This role will require an on-site presence.

Posted: 2022-05-05 Expires: 2022-06-05

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Oregon Wafer Level Assembly Process Engineer

Intel
Hillsboro, OR 97123

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