18 days old

OWLA Yield/Integration Engineer

Hillsboro, OR 97123
  • Job Code
Job Description

As a Yield/Integration Engineer, you will be part of OWLA (Oregon Wafer Level Assembly), Intel's first die-disaggregation HVM (High-Volume Manufacturing) factory tasked with deploying and ramping advanced packaging products based on Foveros and derivative technologies.

Scope of the Yield/Integration Engineer will include process technology transfer from WATD (Wafer Assembly Technology Development ), shaking out issues during HVM1 deployment/ramp, and transfer to subsequent HVM factories.

Responsibilities will include but not be limited to:

  • Seeding with TD (Technology Development) partners through technology development phase leading to deep knowledge of integrated process flow and challenges, inclusive of FBE (Far Back End) fab, WLA (Wafer Level Assembly), AWP (Advanced Wafer Prep) and C4 segments.
  • Drive key integrated process changes to improve manufacturability or resolve technology marginality items.
  • Leading task forces to solve integrated problems.
  • Enable smooth NPI (New Product Introduction) coordination for products, working with Planning, Manufacturing, Automation, and Engineering partners in the factory
  • Review of factory expansion and continuous improvement for WLA and AWP segments.
  • Engage in definition and participation of HVM Change Control structure.

What we offer:

  • Growth opportunity to develop leadership skills
  • Rapidly growing organization with probable future leadership opportunities


You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Requirements:

  • Candidate must possess Bachelor's degree with 6+ years of industry experience or Master's degree with 4+ years of industry experience or PhD degree with 2+ years of industry experience in engineering discipline.
  • 5+ years of experience in one or more of the following:
    • Microelectronic packaging and assembly
    • Experience in leading large, cross-functional teams in working group and task force environment
    • Experience and expertise in model based problem solving

Preferred Qualifications:

Experience with any of the following:

  • Startup of new technologies
  • Deployment of new business processes
  • Leadership in Model Based Problem Solving (MBPS) Teams
  • Process improvement using Intel Change Control Process
  • NPI project management
  • Process Continuous Improvement projects
  • Yield analyses scripting
  • Metrology or Low Yield Analyses/Failure Analyses techniques for problem solving

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

Posted: 2022-05-08 Expires: 2022-06-08

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OWLA Yield/Integration Engineer

Hillsboro, OR 97123

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