18 days old

OWLA Yield Integration Engineer

Hillsboro, OR 97123
  • Job Code
Job Description

You will be a member of the Oregon Wafer Level Assembly (OWLA) organization at Intel's Ronler Acres campus. This is a startup factory playing a pivotal role in the company's disaggregation manufacturing roadmap.

The Yield Integration Engineers are responsible for partnering with process engineering, manufacturing, Q and R, and support teams to drive process sustaining excellence, responding to and driving resolution of process quality events, change control, and new product introduction. Responsibilities may include, but are not limited to:

  • New Product Introduction (NPI) activities, which includes leading coordination efforts within factory to meet program milestones.
  • Responding to quality events in the high-volume WLA process line, containing, and dispositioning suspect material, and driving preventative measures.
  • Partnering with process engineering and manufacturing teams to harden High Volume Manufacturing (HVM) processes.
  • Leading cross-functional teams through model-based problem-solving methodology to resolve process excursions and defect reduction activities for line yield or electrical yield improvements.
  • Partnering with Technology & Development (TD) and factory partners to certify/ramp new technologies and products and own transfer to subsequent HVM factories.
  • Communication skills and willingness to work with teams spread across different geographies and organizations.
  • Must role model One Intel culture and possess fast learning skills to understand new concepts related to diverse fields and apply them on the job to solve complex problems.

This is an entry level position and will be compensated accordingly.


Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum qualifications:

  • Candidate must possess a Bachelor's degree in an Engineering field with 2+ years of semiconducting processing or microelectronic packaging or assembly experience; or Master's degree in an Engineering field.

Preferred qualifications:

  • 2+ years of experience in process development.
  • 2+ years of experience in assembly/packaging or advanced packaging
  • Model based problem solving experience.
  • Knowledge of NPI methodology, design of experiments (DOE), and statistical process control.
  • Experience in leading teams in working group or task force environments.
  • Knowledge of statistical process control techniques, JMP/SQL data analysis tools
  • Working knowledge of logistics systems and shop floor control systems such as ASPIRE, SPEED, Workstream, and MES.
  • Working Knowledge of Defect Metrology and Characterization tools

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

Posted: 2022-05-09 Expires: 2022-06-09

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OWLA Yield Integration Engineer

Hillsboro, OR 97123

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