17 days old

Package Architect

Intel
Phoenix, AZ 85003
  • Job Code
    JR0217280
Job Description

Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors.

The external Packaging and Assembly Engineering team (EPAE) will play a critical role in this strategy, leveraging external assembly technologies to deliver leadership products

Microelectronic Packaging Architecture Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.

Responsible for but not limited to:

  • Ensuring the thermal/mechanical/electrical design, affordability, performance, reliability and manufacturability analysis to meet product requirements
  • Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design.
  • Define overall package performance and specification realize technology certification through layout design and test vehicle design.
  • Package designs and technology selection.
  • Assess and mitigate risks associated with the product designs.
  • Working with cross-functional groups to determine package requirements in order to meet electrical, optical, mechanical, thermal, and reliability requirements.
  • Define and conduct overall tolerance analysis for component and sub-assemblies.
  • Interact with suppliers and optimize designs based on supplier's processes and capabilities.
  • Generate all component drawings, layouts, assembly drawings for product and tooling.

The ideal candidate should exhibit the following behavioral traits:

  • Motivated self-starter / self -driven with strong ability to work independently as well as influence the team.
  • Excellent listening, written and verbal communication, tolerance of ambiguity, and commitment to tasks.
  • Skills to address complex problems and find solutions proactively.
  • Highly collaborative that can effectively drive stakeholders to win results for Intel.
  • Excel in leading in a highly matrixed development environment.
  • Executes toward results with focus and a sense of urgency.
  • Motivated individual with a can-do attitude.
  • Willing to take informed risks to achieve desired team goals.
  • Strengthen our team through deep understanding of external capabilities and system requirements. With the key objectives to develop the competitive package based on system and product requirements and identifying technical limits and opportunities.
  • Build a strong and intimate relationship with the team and divisions across multiple levels and organizations, timely execute/drive established tasks in close collaboration with the platform manager and partner teams.
  • Strongly collaborate with platform management and package development teams. Direct influence product package architecture strategy through broad experience and expertise on systems. Develop a metric to influence external assembly roadmap direction based on application-based differentiation aspects (system, design, performance and cost).


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. This Position not eligible for Intel immigration sponsorship.

Minimum Qualifications:

  • Master's Degree in an Engineering field relevant to R and D activities in VLSI design, materials or semiconductor manufacturing or a related field of study.
  • 6+ years of practical experience in assembly technologies preferred in package concept, design, simulation and packaging development area.
  • 5+ years of hands-on experience with typical design tools (e.g. AutoCAD)

Preferred Qualifications:

  • A Ph.D. or master degree in Electronics, Physics, Material science, microsystem technology or similar,  with 4 + years of experience.
  • Experience with design and design rules.
  • Experience in advanced packaging technologies development or pathfinding
  • Experience in virtual basic programming and CAD drawing

Inside this Business Group

Intel's Sales and Marketing (SMG) organization works with global customers and partners to solve critical business problems with Intel based technology solutions. SMG works across business units to amplify the customer voice and deliver solutions that accelerate their business. We work across numerous industries, including retail, enterprise and government, cloud services and healthcare as examples. The operations team focuses on forecasting, driving alignment with factory production and delivering efficiency tools and our marketing capability drives demand and localized marketing in locations around the globe. Our sales force navigates a complex partner and customer ecosystem while shaping product roadmaps, driving value for our customers, and collaborating to harness emerging technology trends to deliver comprehensive solutions.


Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.



Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

Posted: 2022-05-04 Expires: 2022-06-04

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Package Architect

Intel
Phoenix, AZ 85003

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