6 days old

Package Technology Development Quality and Reliability Engineer

Phoenix, AZ 85003
  • Job Code
Job Description

This is an entry level position and compensation will be given accordingly.

As a Quality and Reliability Engineer, you'll join a team developing leading edge semiconductor package technologies for Intel's latest products. We use a wide variety of skills, from analytical models to advanced experimental designs to extensive data analysis, to evaluate and improve the package technology. Together with our technology development partners, we find the root cause of failure mechanisms and devise solutions. We measure our success by delivering world-class quality on cutting edge package technologies, faster and at a competitive cost.

Main responsibilities:

-Set reliability requirements for next generation package technologies based on customer use conditions.
-Influence new package technology design, process and material decisions based on fundamental technical knowledge.
-Design test vehicles to isolate failure mechanisms and the root causes.
-Innovate analytical and experimental methods to validate package technology reliability.
-Deliver analysis results and impact to multiple levels within the quality and reliability community and business partners.

Candidate should exhibit the following behavioral traits:

-Communication skills to develop strategies to advocate effective change.
-Examples of making the complex simple and understood by a wide audience


You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. 

Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

  • Candidate must have a Ph.D. degree in Mechanical Engineering, Material Science, Physics, Chemical Engineering, Chemistry or Electrical Engineering with 1+ years experience in related field.
  • 1+ years of experience characterizing mechanical or electrical properties of materials.
  • 1+ years of experience with large empirical datasets using statistical analysis, including addressing challenges with incomplete data.
  • 1+ years of experience leading and influencing cross-functional teams to achieve extraordinary results.
  • Candidate must have 6+ months of experience creating detail project plans.

Preferred Qualifications:

  • Experience in semiconductor fabrication process, packaging assembly, automated test and/or board system technology operations.
  • Experience with mechanical testing, accelerated environmental testing, reliability testing and standards.
  • Experience in empirical data collection and statistical data analysis, reliability statistics, and design of experiments.
  • Experience with any of the following imaging and analytical lab techniques: such as acoustic imaging, and x-ray imaging, SEM, EDX, TEM, FTIR, TMA, DMA, DSC, TGA, SIMS and mechanical testing machines.
  • Basic programming or scripting for data analysis such as SQL PF, Python. Experience with statistical software, JMP, MATLAB, Excel Macros, or equivalent.

Must have the required degree or expect the required degree by June 2022

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Other Locations

US, Oregon, Hillsboro

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

Posted: 2022-05-17 Expires: 2022-06-18

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Package Technology Development Quality and Reliability Engineer

Phoenix, AZ 85003

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