5 days old

Packaging Chemical Mechanical Polishing Research and Development Engineer

Hillsboro, OR 97123
  • Job Code
Job Description

Wafer Assembly Technology Development (WATD) is a department of Assembly and Test Technology Development (ATTD) which owns developing die prep and wafer level packaging process Technology Development Engineers focused on developing process equipment capabilities needed for next generation advanced packaging of Intel's products.

Responsibilities will include but not be limited to:

  • Own process development and program management
  • Develop wafer level advanced packaging acumen
  • Applying principles for design of experiments and data analysis
  • Defining strategies to drive solutions to a wide range of theoretical and practical problems which require a high degree of innovation and ingenuity
  • Conducts tests and research on basic materials and properties
  • Develops solutions to problems utilizing formal education and judgment
  • Transferring process to HVM Teams


You must possess the below minimum qualifications to be initially considered for this position. 

Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. 

For information on Intels immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information.

Minimum Qualifications

  • Possess a master's degree (with 4+ years of relevant experience) or PhD degree (with 1+ years of relevant experience) in Chemical Mechanical Polishing, Material Science Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, Optical Engineering, Polymer Science and Engineering or related field

Preferred Qualifications

4+ years of experience in Chemical Mechanical Polishing.

2+ years of experience with one or more of the following:

  • Semiconductor fabrication processes and technology
  • Project Management experience with external Vendors

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Work Model for this Role

This role will require an on-site presence.

Posted: 2022-06-25 Expires: 2022-07-26

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Packaging Chemical Mechanical Polishing Research and Development Engineer

Hillsboro, OR 97123

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