Intel Corporation's CCG Packaging Engineering and Operations team (PEO) is seeking an experienced Packaging Engineer to support numerous BU's across Intel. Primary responsibilities will be developing and designing structural packaging for retail and distribution-type products.

Responsibilities will include but not be limited to:

- Developing packaging that can operate on manual and automated packaging manufacturing equipment.
- Conducting environmental tests such as: shock, vibration, compression, ESD static dissipative.
- Driving packaging engineering issues and/or improvements through numerous Intel divisions for PE consensus and accountability.
- Implementing cost savings measures with innovative packaging designs and strategies when applicable.
- Creating CAD drawings of packaging components for production purposes.
- Working with numerous internal and external groups to successfully launch products.
- Performing design-for-manufacturability (DFM) with manufacturing counterparts.
- Creating part numbers and implementing ECO's as needed utilizing Intel database.

- Electrostatic Discharge (ESD) evaluation of materials

The ideal candidate will have the following skills and behavioral traits:

- Ability to handle multiple tasks at one time with little direction.
- Excellent communication skills with internal and external groups
- Understanding of Bills of Materials and Engineering Change Orders (ECOs)

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

BS in Engineering, Packaging Engineering or related degree with a minimum of 5 years of Packaging Engineering experience. Preferred (but not required) in a retail product environment.

3+ years of experience in the following:
- Solidworks, ArtiosCAD, and/or an equivalent program with an understanding of drafting principles per ANSI standard.
- Design experience in corrugated, folding cartons, plastic thermoforms, injection molded plastic, and fabricated and molded cushioning foams.
- Packaging printing processes; material selection; material production and processes; and innovative package design capability.
- Packaging shock and vibration principles.

The Client Computing Group (CCG) is responsible for driving business strategy and product development for Intel's PC products and platforms, spanning form factors such as notebooks, desktops, 2 in 1s, all in ones. Working with our partners across the industry, we intend to continue to advance PC experiences to deliver the real-world performance people demand. As the largest business unit at Intel, CCG is investing more heavily in the PC, ramping its capabilities even more aggressively, and designing the PC experience even more deliberately, including delivering a predictable cadence of leadership products. As a result, we are able to fuel innovation across Intel, providing an important source of IP and scale, as well as help the company deliver on its purpose of enriching the lives of every person on earth.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.