Become a member of the Assembly and Test Technology Development (ATTD) Media, Inspection, Handling, and Laser Systems (MIHL) Module Engineering team as an equipment development engineer in the discovery, development, and deployment of Intel's advanced chip packaging process technology. In this position your responsibilities include leading projects and packaging development focused on packaging equipment technology in assembly and finish process flows. In this role you will collaborate with Assembly and Finish development teams, ATTD Manufacturing, and external vendors to ensure we deliver industry leading equipment technology, on time, and at the lowest total cost. Equipment development engineers own defining and delivering the technical capabilities required to meet Intel's Packaging Roadmap. They ensure process capability specs and designs are defined and optimized early in the development cycle to ensure high confidence to meet process requirements and engineer out non-value added steps for a lean manufacturing process. They manage cross module teams, including ATM site partners, to collect and analyze data throughout the stages of development to validate process capability and stability prior to technology transfer to high-volume manufacturing.

The candidate should also exhibit the following behavioral traits/skills: Technical team leadership skills: setting direction, strategic planning, influencing skills, technical and analytical skills, communication skills in a highly matrixed environment managing budget, resources/timelines, and stakeholders.

Qualifications

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You must possess the below minimum qualifications to be initially considered for this position.
Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.

Minimum Qualifications
Possess a Bachelor's, Master's, or PhD degree in Mechanical Engineering or Electrical Engineering or Physics or related STEM field

Preferred Qualifications
1+ years of experience with one or more of the following:
Statistical design of experiments and problem-solving techniques, and willingness to apply fundamental science and engineering concepts to create novel solutions
Semiconductor Packaging Equipment and Process flow Development
Semiconductor devices and fabrication processes and technology
Background in Robotics System Design and Qualification
Background in Laser drilling and ablation of Semiconductor devices

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.