16 days old

Packaging R&D Engineer

Hillsboro, OR 97123
  • Job Code
Job Description

Microelectronic Packaging Engineers in Assembly Test and Technology Development (ATTD) will be expected to:

  • Provide project management package design/development and sustaining support for integrated circuit or semiconductor assemblies various other electronic components/completed units.

  • Be responsible for the thermal/mechanical/electrical design analysis and development of electronic packages.

  • Define overall package performance and specification and realize technology certification through layout design and test vehicle design.

  • Conduct tests and research on basic materials and properties.

  • Establish material specifications for contract assemblers and raw material vendors and interface with Quality Assurance and Purchasing regarding material quality and vendor performance.

  • Provide consultation concerning packaging problems and improvements in the packaging process.

  • Respond to customers requests or events as they occur.

  • Develop solutions to problems utilizing formal education and judgment.

The candidate should also exhibit the following behavioral traits/skills:

  • Technical innovation and deliver results for complex time critical technical projects

  • Technology with technical and analytical skills

This is an entry level position and will be compensated accordingly.


You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

Possess a master's degree with 1+ year of experience or PhD degree with 6 months of experience in Mechanical Engineering OR

  • Material Science Engineering

  • Chemical Engineering

  • Electrical Engineering

  • Physics or Chemistry

  • Optical Engineering

  • Polymer Science and Engineering or related field.

Candidate must possess the degree or expect to complete the required degree by employment start date.

Preferred Qualifications:

6+ months of experience with one or more of the following:

  • Fundamental science and engineering concepts in development to create novel solutions

  • Statistical Process Control (SPC)/Design of Experiments (DOE) principles

  • Semiconductor fabrication processes

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Posted: 2022-05-09 Expires: 2022-06-10

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Packaging R&D Engineer

Hillsboro, OR 97123

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