23 days old

Packaging R&D Engineer

Intel
Hillsboro, OR 97123
  • Job Code
    JR0204405
Job Description

Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.

  • Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages.

  • Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design.

  • Conducts tests and research on basic materials and properties.

  • Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.

  • Provides consultation concerning packaging problems and improvements in the packaging process.

  • Responds to customer/client requests or events as they occur.

  • Develops solutions to problems utilizing formal education and judgment.


Qualifications

This position is not eligible for Intel immigration sponsorship.
You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

  • Possess a bachelor's degree and 3+ months of relevant experience in one of the following majors Mechanical Engineering or Material Engineering or Electrical Engineering or Physics related field OR a Master's degree in one of the following majors Mechanical Engineering or Material Engineering or Electrical Engineering or Physics related field


Preferred Qualifications:

3+ months of experience with:

  • Statistical Process Control (SPC) and/or Design of Experiments DOE principles

  • Semiconductor fabrication processes and technology

  • Fundamental science/engineering concepts in development to create novel solutions

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.


Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Posted: 2022-04-27 Expires: 2022-05-29

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Packaging R&D Engineer

Intel
Hillsboro, OR 97123

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