1 day old

Packaging R&D Engineer

Intel
Phoenix, AZ 85003
  • Job Code
    JR0202087
Job Description

Microelectronic Packaging Engineers in Assembly and Test Technology Development (ATTD) will be working in Assembly Module Engineering Department to: Develop innovative equipment, process and material integration solutions to enable Intel's roadmap of future packaging platform technologies, Engage with multifunctional and cross-organization teams to drive assembly processes and equipment that meet quality, reliability, cost, yield, productivity, and manufacturability targets, Conduct research and fundamental studies on materials, equipment, and fabrication processes to improve semiconductor packaging technologies, Provide project management to meet product development timelines, Develop solutions to problems utilizing formal education and judgment, Provide sustaining support to meet equipment performance and process health requirements in high volume manufacturing (HVM)Respond to customer's requests or events as they occur. The ideal candidate should exhibit the following behavior traits: Technical leadership skills: leadership, strategic planning, critical thinking, coaching and development of a technical team, Tolerance for ambiguity in a fast-paced, constantly changing product roadmap environment, Flexibility in changing priorities and responsibilities to support business needs, Lead teams in a highly matrixed environment managing multiple projects, timelines, resources, and stakeholders, Action-oriented, self-starter with willingness to work independently, Communication and influencing skills, Technical and analytical skills


Qualifications

You must possess the below minimum qualifications to be initially considered for this position.
Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.
Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

This is an entry level position and will be compensated accordingly.

Minimum Qualifications

Possess a PhD degree or Master's degree with 1+ years of experience in Engineering or Physics/Applied Physics or related field.
Candidate must possess the degree by employment start date

Preferred Qualifications

+1 years of experience with one or more of the following:
Fundamental science and engineering concepts in technology development to create novel solutions including knowledge of Design of Experiments (DOE) and Statistical Process Control (SPC) principles
Technical innovation and results focus for complex and time-critical technical projects
Semiconductor fabrication processes and technology
Equipment ownership, change control management and design for manufacturability

Benefits

We offer a total compensation package that ranks among the best in the industry

It consists of competitive pay, stock, bonuses, and benefit program

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.


Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Posted: 2022-06-23 Expires: 2022-07-25

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Packaging R&D Engineer

Intel
Phoenix, AZ 85003

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