11 days old

Packaging Research and Development Engineer

Intel
Hillsboro, OR 97123
  • Job Code
    JR0211786
Job Description

Packaging research and development engineer position with Assembly and Test Technology Development (ATTD) Core Competency Laboratory at Intel to support the development of new packaging technologies and assembly processes.

Responsibilities include, but are not limited to:

  • Qualifying, trouble shooting, and utilizing metrologies to characterize materials, components, and assembly processes.

  • Designing and integrating new custom, first-of-kind tools for mechanical and material characterization. Developing methodologies for the same.

  • Defining requirements of metrologies and assessing capabilities of metrologies.

  • Preparing test material, formulating experiments or test strategies, executing experiments, reducing data, and drawing conclusions.

  • Engaging with stakeholders and partners to explore opportunities, define project plan, assess and manage risks, and execute to committed schedule and targets.

  • Utilizing sound technical judgment and research resources to overcome technical challenges.

  • Managing work priorities and engaging with stakeholders to ensure timely completion of deliverables.

  • Participating and leading growth of team in technical and non-technical ways.

  • Documenting procedures, processes, and work results.

  • Observing and promoting safety, EHS, and ISO compliance.


The successful candidate will demonstrate the following characteristics:

  • Solid foundation in technical principles and practices of empirical science and willingness to perform due diligence in own work.

  • Demonstrated willingness to quickly learn use of new tools and to understand technical principles and limitations of metrologies.

  • Willing to overcome and manage ambiguity and uncertainty.

  • Self-motivation and pro-activeness to understand context and impacted adjacencies of work and to overcome challenges.

  • Project planning and project management skills to deliver on schedule and commitments.

  • High degree of intellectual curiosity, creativeness to develop new solutions, and willingness to try new approaches.

  • Self-accountability to apply necessary technical rigor to own work.

  • Diligence in documenting work and results.

What we offer: 

  • We give you opportunities to transform technology and create a better future, by delivering products that touch the lives of every person on earth. 

  • As a global leader in innovation and new technology, we foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. 

  • We offer a competitive salary and financial benefits such as bonuses, life and disability insurance, opportunities to buy Intel stock at a discounted rate, and Intel stock awards (eligibility at the discretion of Intel Corporation). 

  • We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and much more creative perks that make Intel a Great Place to Work! 

We're constantly working on making a more connected and intelligent future, and we need your help. Change tomorrow. Start today.
 


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.


Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job, military, and/or internship experiences.

Minimum Requirements:

  • Possess a master's, PhD, or ScD degree in Materials Science/Engineering, Mechanical Engineering, Aerospace Engineering, experimental Physics, or a related experimental mechanics discipline.

6+ months of experience with one or more of the following:

  • Mechanical or material testing instruments (MTS, Instron, or equivalent) and fixture development.

  • Conventional techniques of mechanical and material testing (instrumented indentation, hardness, fatigue, creep, bend, fracture toughness, impact, adhesion, etc.).

  • Material and sample preparation for mechanical testing.

Candidate must possess the degree by employment start date.


Preferred Requirements:
6+ months of experience with one or more of the following:

  • Non-contact surface topography and material deformation characterization techniques such as, but not limited to, more, interferometry, digital image correlation, or other quantitative optical metrologies.

  • Experience in packaging and wafer level assembly technologies and processes.

  • Experience in mechanical and material characterization of organic and inorganic thin films, including techniques for thermal expansion, adhesion, film stress, etc.

  • Statistical concepts of empirical science and experiment design.

  • MATLAB, Python, and/or LabView programming.

  • Hands-on, independent equipment development and integration experience with sensor, actuators, controllers and data acquisition systems.

  • Experience in metrology development, metrology capability assessment, gage R and R or related.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.


Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.



Work Model for this Role

This role will require an on-site presence.

Posted: 2022-05-16 Expires: 2022-06-16

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Packaging Research and Development Engineer

Intel
Hillsboro, OR 97123

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