10 days old

Packaging Research and Development Engineer

Intel
Hillsboro, OR 97123
  • Job Code
    JR0221714
Job Description

Position is for a Technologist in the Assembly and Test Technology Development (ATTD0 organization in the area of electronic packaging/assembly related tools and methods to support various initiatives to drive heterogenous integration and sustain Moores law.

  • The candidate will be part of the ATTD Core Competency group, leading the effort to work across teams in the group and ATTD, to provide a coordinated response to specific challenges related to mechanical integrity and materials response.
  • The candidate will need to comprehend diverse needs across the different areas of package substrate and assembly related to tool development, structural/materials response, dimensional integrity and reliability parameters.
  • The candidate will also need to evaluate new advanced packaging technology and process needs and drive the definition, development and deployment of common metrology methods, tools and analysis solutions across groups.
  • The job requires the candidate to lead the effort to provide effective solutions to support pathfinding, technology development and high volume manufacturing in the areas of mechanical and dimensional integrity as well as key critical-to-function process parameters.
  • The job scope also requires the candidate to work in roles that require both, long term strategy definition and roadmap execution, as well as daily tactical efforts.
  • Requires building strong working relationships with external vendors and internal organizations to deliver technologies with world class safety, performance, and cost.  


Qualifications

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.


Minimum Qualifications

  • Possess a bachelor's degree in Mechanical Engineering or related discipline with 10+ years of work experience in the semiconductor packaging/assembly industry.


Preferred Qualifications

10+ years of experience with one or more of the following:

  • Technical experience in tools and methods related to materials characterization, materials response/structural integrity, dimensional measurements, and process monitoring.
  • CPU packaging/sockets, relevant Industry Standards (JEDEC, IPC), and package/board assembly process, such as surface mount technologies.
  • Proven record of collaborating across organizational boundaries
  • Statistical methods and tools


 

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.


Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.



Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

Posted: 2022-05-09 Expires: 2022-06-09

Before you go...

Our free job seeker tools include alerts for new jobs, saving your favorites, optimized job matching, and more! Just enter your email below.

Share this job:

Packaging Research and Development Engineer

Intel
Hillsboro, OR 97123

Join us to start saving your Favorite Jobs!

Sign In Create Account
Powered ByCareerCast