16 days old

Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003
  • Job Code
    JR0210434
Job Description

Become a part of Intel's Advance Packaging Team by joining the Substrate Packaging Technology Development (SPTD) organization. Our mission is to be the supplier of choice for leading and affordable substrate packaging. Join the SPTD organization to assist in achieving our mission and continuing to make this a great place to work.

Responsibilities are but not limited to:

  • Substrate Packaging Technology Development SPTD Microelectronic Packaging Research and Development Engineers provide project management, new material development, and sustaining support for IC and/or semiconductor manufacturing processes.

  • Innovation problem solving development and continuous improvement of processes and materials through design of experiments and statistical methods.

  • Daily sustaining of process and SPC health, resolving process excursions.

  • Work with integration, program leads and key functional partners to ensure success qualification and implementation of new materials and processes.

  • Interacting with patterner organizations to transfer new equipment, processes, share learnings and drive improvements.

  • Partnering with the Manufacturing team to assist technicians with their technical development.


The ideal candidate should exhibit the following behavioral traits:

  • Problem solving analytical written and verbal communication skills and troubleshooting willingness.

  • Flexibility in changing priorities and responsibilities to support business needs.

  • Work with ambiguity in a fast paced constantly changing product roadmap environment.

  • Self initiated, action oriented with the willingness to work independently.

  • Participation and ownership frequent floor presence and interaction with manufacturing personnel.

  • Demonstrate technical innovation and the ability to deliver results for complex time critical technical projects.

  • Willingness to apply fundamental science and engineering concepts in development to create novel solutions.


This is an entry level position and compensation will be given accordingly.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Knowledge and/or experience listed below would be obtained through a combination of your school work and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

  • Candidate must possess a BS degree with 6+ months of experience or MS degree in Chemical engineering, Mechanical engineering, Electrical engineering, Materials Science Engineering or Physics or a related field.


Must have the required degree or expect the required degree by June 2022.

Preferred Qualifications:
1+ years of experience in the following:

  • PVD, plasma etching experience.

  • Owning process tools with knowledge of SPC, PCS, equipment troubleshooting statistical design of experiments and process development.

  • Engineering troubleshooting and analytical skills on integrated technology issues.

  • Experience working with broad team of other process and integration engineers.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.


Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.



Work Model for this Role

This role is available as fully home-based and generally would require you to attend Intel sites only occasionally based on business need.

Posted: 2022-05-08 Expires: 2022-06-08

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Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003

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