8 days old

Packaging Research and Development Engineer

Phoenix, AZ 85003
  • Job Code
Job Description

Become a part of Intel's Advance Packaging Team by joining the Substrate Packaging Technology Development (SPTD) organization. Our mission is to be the supplier of choice for leading and affordable substrate packaging. Join the SPTD organization to assist in achieving our mission and continuing to make this a great place to work.

What we offer:

  • We give you opportunities to transform technology and create a better future, by delivering products that touch the lives of every person on earth.

  • As a global leader in innovation and new technology, we foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results.

  • We offer a competitive salary and financial benefits such as bonuses, life and disability insurance, opportunities to buy Intel stock at a discounted rate, and Intel stock awards (eligibility at the discretion of Intel Corporation).

  • We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and much more creative perks that make Intel a Great Place to Work.

  • This position requires the majority of time spent on the factory floor and/or interacting with equipment/material suppliers.

The candidate will join and become part of a world class first of a kind embedded die packaging facility, learn advanced substrate manufacturing know-how, drive disruptive technology innovations, and be part of creating history in the substrate packaging industry.

Responsibilities will include but not be limited to:

  • Define and establish equipment configurations, process specifications, and integrated process flow for new process technologies.

  • Plan and conduct comprehensive DOEs to fundamentally characterize process window, and understand process / equipment / materials interactions.

  • Drive continuous process improvements on process capability/stability, quality/reliability, cost/yield, automation, and productivity.

  • Lead and participate in cross-functional and cross-organizational teams or work groups that support substrate technology development.

The ideal candidate should exhibit the following behavioral traits and/or skills:

  • Written and verbal communication and teamwork skills.

  • Interact with equipment and materials suppliers.

  • Willingness to travel (some travel may be required, less than 5 percent).

  • Work with ambiguity and flexibility with respect to job roles and working hours is required.


You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research, and relevant previous job and internship experience. This req does allow Intel immigration sponsorship.

Minimum Qualifications:

  • Candidate must possess a bachelor's degree (with 3+ years of relevant experience) OR a master's degree (with 1+ years of relevant experience) in Materials Science and Engineering/Chemical Engineering/Organic Chemistry/Polymer Engineering/Mechanical Engineering or any other related engineering degree.

Achieve required degree by Sept 2022.

Specific areas of expertise should include the following (preferred):

  • Engineering troubleshooting and analytical skills on integrated technology issues and experience working with broad team of other process and integration engineers.

  • Experience owning process tools with strong knowledge of SPC PCS RFCs equipment troubleshooting statistical design of experiments and process development.

  • Experience working with a variety of organic/inorganic materials and processes as well as characterizations utilizing techniques such as DSC, TGA, D/TMA, Titration, ICPMS, FTIR, XPS, TOFSIMS, EDX, SEM, etc. is highly desirable.

  • Experience with statistical data analysis, JMP and JSL, Python, relational database structure and usage, machine learning.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Work Model for this Role

This role is available as fully home-based and generally would require you to attend Intel sites only occasionally based on business need.

Posted: 2022-07-30 Expires: 2022-08-30

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Packaging Research and Development Engineer

Phoenix, AZ 85003

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