2 days old

Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003
  • Job Code
    JR0213935
Job Description

Microelectronic Packaging Engineers in Assembly and Test Technology Development (ATTD) will be working in Assembly Module Engineering Department to:

  • Develop innovative Second Level Interconnect (SLI) solutions to enable Intel's roadmap of future packaging platform technologies.
  • Engage with multifunctional and cross-organization teams to drive SLI assembly processes that meet quality, reliability, cost, yield, productivity, and manufacturability targets
  • Conduct research and fundamental studies on equipment, materials, and fabrication processes to improve semiconductor packaging technologies
  • Develop solutions to problems utilizing formal education and judgment
  • Provide sustaining support to meet equipment performance and process health requirements in high volume manufacturing (HVM)
  • Provide project management to meet product development timelines


The ideal candidate should exhibit the following behavior traits:

  • Technical leadership skills: leadership, strategic planning, critical thinking, coaching and development of a technical team
  • Tolerance for ambiguity in a fast-paced, constantly changing product roadmap environment
  • Flexibility in changing priorities and responsibilities to support business needs
  • Lead teams in a highly matrixed environment managing multiple projects, timelines, resources, and stakeholders
  • Action-oriented, self-starter with willingness to work independently
  • Communication and influencing skills
  • Technical and analytical skills
  • Technical innovation and results focus for complex and time-critical technical projects

This is an entry level position and will be compensated accordingly.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.

Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications

  • Possess a PhD degree with 1+ years of experience in Mechanical Engineering or Materials Science or Physics/Applied Physics or related field
  • Have 1 or more publications in a peer-reviewed technical journal
  • Candidate must possess the degree by employment start date

Preferred Qualifications


+1 years of experience with one or more of the following:

  • Semiconductor fabrication processes and technology
  • Mechanical design is a plus

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.


Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.



Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

Posted: 2022-05-25 Expires: 2022-06-25

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Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003

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