27 days old

Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003
  • Job Code
    JR0211510
Job Description

As a Packaging Research and Development Engineer with Assembly and Test Technology Development you will be working in the Experimental Mechanics Lab dealing with thermo-mechanical challenges in the development of advanced packaging technologies.

The personnel in this lab use a variety of tools to study the behavior of electronic packages and their material constituents under different mechanical/thermal loading conditions: like dynamic warpage of packages using optics-based tools (like Shadow Moire, Twyman Green Interferometry, Fizeau Interferometry, Confocal); interfacial adhesion strength using Double Cantilever Beam test; fracture toughness of bulk materials using three-point bend test; material CTE using Digital Image Correlation method; and crack (or defect) detection and classification using acoustic emission (or optical) sensors and AI/ML codes. Employees also develop new metrologies and software capabilities for use with next-gen packaging technologies.

The candidate should also exhibit the following behavioral traits/skills:

  • Experimental Mechanics background, along with problem solving and programming skills.

This is an entry level position and will be compensated accordingly.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.

Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

  • Possess a Master's degree and 6+ months of experience or PhD degree and 1+ years of experience in one of the following majors: Mechanical Engineering, Aerospace Engineering, Materials Science and Engineering, or related field

Must have the required degree before starting in the position.

Preferred Qualifications:
6+ months of experience (master's degree) or 1+ years of experience (PhD degree) with one or more of the following:

  • Material characterization, load frames, DAQs, PID controllers, basic optics, 3D CAD and/or structural health monitoring.

  • LabView, Matlab, and/or Python programming.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.


Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.



Work Model for this Role

This role will require an on-site presence.

Posted: 2022-04-28 Expires: 2022-05-29

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Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003

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