28 days old

Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003
  • Job Code
    JR0219385
Job Description

Become a part of Intel's Advance Packaging Team by joining the Substrate Packaging Technology Development (SPTD) organization. Our mission is to be the supplier of choice for leading and affordable substrate packaging. Join the SPTD organization to assist in achieving our mission and continuing to make this a great place to work.

Substrate Packaging Technology Development (SPTD) Microelectronic Packaging Research and Development (R and D) Engineers enable substrate and packaging technologies for development of new materials, equipment, process flows and process improvements.

Responsibilities will include, but are not be limited to:

  • Innovation, problem solving, development and continuous improvement of equipment and processes through application of experimental design and statistical methods.

  • IC substrate process and equipment development, including application of novel concepts in manufacturing technology solutions for next-generation devices.

  • Process and equipment specification development, application of principles for design of experiments and data analysis - in addition to planning and documentation of improvements through the change control process.

  • The training of additional engineers and technicians to facilitate technology and process transfer to other factories worldwide for High Volume Manufacturing (HVM).


The ideal candidate should exhibit the following behavioral traits and/or skills:

  • Written and verbal communication skills.

  • Problem-solving, analytical and troubleshooting abilities.

  • Flexibility in changing priorities and responsibilities to support business needs.

  • Tolerance for ambiguity in a fast-paced, constantly changing product roadmap environment.

  • Self-initiated, action-oriented with the willingness to work independently.

  • Participation and a sense of ownership; frequent floor presence and interaction with manufacturing personnel.

  • Demonstrate technical innovation and delivered results for complex, time-critical technical projects.

  • Willingness to apply fundamental science and engineering concepts in development to create novel solutions.


This is an entry level position and compensation will be given accordingly.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position.
Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
Knowledge and/or experience listed below would be obtained through a combination of your school work and/or classes and/or research and/or relevant previous job and/or internship experiences .

Minimum qualifications:

  • Candidate must possess a PhD degree with 1+ years of experience in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, Physics or a related field.


Must have the required Ph.D. degree or expect the required degree by July 2022


1+ years of experience in the following:

  • Electrochemistry and/or vacuum deposition techniques.


Preferred qualifications:

1+ years of experience in the following:

  • Process and equipment development for applications in the Integrated Circuit (IC), packaging or Printed Circuit Board (PCB) industry.

  • Semiconductor and/or IC substrate fabrication processes and technology.

  • Material structure-property relations, polymer and/or metal and/or composite material mechanical properties, solid mechanics, organic chemistry, organic composites and polymer chemistry and/or physics.

  • Optical microscopy, electron microscopy (SEM, FIB, TEM, and EBSD), analytical techniques (FTIR, Raman, TGA, DSC), Surface analysis (XPS, TOF-SIMS), EDS, AFM, XRD, mechanical cross-sections and other package-level failure analysis techniques.

  • Statistical data analysis, JMP/JSL, machine learning

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.


Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.



Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

Posted: 2022-04-20 Expires: 2022-05-21

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Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003

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