29 days old

Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003
  • Job Code
    JR0219212
Job Description

Assembly and Test Technology Development (ATTD) Microelectronic Packaging Research and Development Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor processes.

Responsibilities will include, but not be limited to:

  • Assembly processes and/or equipment development, and applying novel concepts in ball attach technology solutions for next-generation CPUs and devices.
  • Developing and innovating solutions to enable Intel's roadmap of future assembly packaging platform technologies.
  • Developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
  • Innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods.
  • Process and equipment specification development, applying principles for design of experiments and data analysis, and planning and documentation of improvements through the white paper process.
  • Developing solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools.
  • Training production and process engineers for technology transfer to other factories worldwide for High Volume Manufacturing.

The candidate should also exhibit the following skills and/or behavioral traits:

  • Proven technical leadership skills in leadership, strategic planning, coaching and development of a technical team.
  • Successfully lead teams in a highly matrix environment managing budgets, resources and timelines, as well as proven stakeholder management.
  • Flexibility in changing priorities and responsibilities to support business needs.
  • Tolerance for ambiguity in a fast paced, constantly changing product roadmap environment.
  • Influencing communication., self-initiated, Action-Oriented and work independently.
  • Participation and a sense of ownership; frequent floor presence and interaction with manufacturing personnel.
  • Demonstrate technical innovation and delivered results for complex, time critical technical projects.
  • Fundamental understanding of semiconductor fabrication processes and technology with technical and analytical skills and problem-solving techniques.
  • Apply fundamental science and engineering concepts in development to create novel solutions.

This is an entry level position and compensation will be given accordingly.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.

Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.


Minimum Qualifications

  • Possess a master's degree with 6+ months experience or PhD degree with 1+ years of experience in one of the following majors: Mechanical Engineering or Material Engineering or Electrical Engineering or Physics or related field
  • Candidate must possess the degree by employment start date

Preferred Qualifications

6+ months of experience (master's) or 1+ years of experience (PhD) with one or more of the following:

  • Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles
  • Application of Computing Science, Data Mining, Data Visualization and Machine Learning to Problem Solving in different engineering fields
  • Semiconductor Technology Development in Fab or Assembly Process

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.


Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.



Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

Posted: 2022-04-20 Expires: 2022-05-21

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Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003

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