23 days old

Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003
  • Job Code
    JR0220594
Job Description

Become a part of Intel's Advance Packaging Team by joining the Substrate Packaging Technology Development (SPTD) organization. Our mission is to be the supplier of choice for leading and affordable substrate packaging. Join the SPTD organization to assist in achieving our mission and continuing to make this a great place to work.

Microelectronic Packaging Research and Development (R and D) Engineers provide project management, integrated circuit (IC) package design/development and sustaining support for IC and/or semiconductor manufacturing processes.

Responsibilities will include, but are not be limited to:


- Innovation, problem solving, development and continuous improvement of equipment and processes through application of experimental design and statistical methods.
- IC substrate process and equipment development, including application of novel concepts in manufacturing technology solutions for next-generation devices.
- Process and equipment specification development, application of principles for design of experiments and data analysis - in addition to planning and documentation of improvements through the change control process.
- Developing and refining analytical and FEA models and simulations using multiphysics software.

Candidate should exhibit the following behavioral traits:


- Solid problem-solving, analytical and troubleshooting willingness.
- Flexibility in changing priorities and responsibilities to support business needs.
- Tolerance for ambiguity in a fast paced, constantly changing product roadmap environment.
- Solid written and verbal communication skills.
- Self-initiated, Action-Oriented with the willingness to work independently.
- Participation and a sense of ownership; frequent floor presence and interaction with manufacturing personnel.
- Demonstrate technical innovation and delivered results for complex, time critical technical projects.
- Willingness to apply fundamental science and engineering concepts in development to create novel solutions.

This is an entry level position and compensation will be given accordingly.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Knowledge and/or experience listed below would be obtained through a combination of your school work and/or classes and/or research and/or relevant previous job and/or internship experiences .


Minimum Qualifications:


- Candidate must possess a BS degree with 3+ months of experience or MS degree with 6+ months of experience in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, Physics or a related field.

Must have the required degree or expect the required degree by September 2022.


-3+ months of experience in finite element analysis or related multi-physics simulation development with strong understanding of underlying governing physics.

Preferred Qualifications:

1+ years of experience In the following:


- Experience in process/equipment development for applications in the IC, packaging or PCB industry.
- Semiconductor and/or IC substrate fabrication processes and technology.
- Material structure-property relations, polymer/metal/composite material mechanical properties, solid mechanics, organic chemistry, organic composites and polymer chemistry/physics.
- Expertise in one or more of the following disciplines: statistical data analysis, JMP/JSL scripting, FEA/FEM modeling, machine learning and/or numerical analysis.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.


Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.



Work Model for this Role

This role is available as fully home-based and generally would require you to attend Intel sites only occasionally based on business need.

Posted: 2022-04-26 Expires: 2022-05-27

Before you go...

Our free job seeker tools include alerts for new jobs, saving your favorites, optimized job matching, and more! Just enter your email below.

Share this job:

Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003

Join us to start saving your Favorite Jobs!

Sign In Create Account
Powered ByCareerCast