20 days old

Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003
  • Job Code
    JR0221487
Job Description

Materials Technology Development (MTD) is looking for a Packaging Research and Development Engineer candidate to be part of Assembly and Test Technology Development (ATTD).

In this role, the individual will be responsible for, but not limited to:

  • Pathfinding, developing, qualifying, and ramping materials to production for use in products across multiple segments
  • Proposing new materials and developing materials target specifications based on alignment with key stakeholders
  • Conducting fundamental studies and performing experiments to characterize materials, identify potential failure modes, understand the structure-property-performance interactions, assess feasibility of material use on product, and make material technology recommendations
  • Working in close collaboration with materials suppliers to develop and source materials formulations that meet technology, quality, availability, and cost targets
  • Developing a fundamental understanding of Intel's assembly process and materials interactions and impact on product performance
  • Collaborating closely with Equipment and Process Engineering to build material technologies on test vehicles and products, and assessing their performance


The candidate should also exhibit the following behavioral traits and/or skills:

  • Technical problem-solving and communication skills
  • Fast-learning skills and expertise in their technical field
  • Willingness to collaborate effectively across multiple teams


This is an entry level position and compensation will be given accordingly


Qualifications

You must possess the below minimum qualifications to be initially considered for this position.
Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.
Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications

  • Possess a PhD degree and 1+ years of experience in Materials Science or Polymer Science or Polymer Chemistry or Metallurgy or Physics or Chemical Engineering or Chemistry or related fields.
  • Candidate must possess the degree by employment start date.


Preferred Qualifications
1+ years of experience with one of more of the following:

  • Data analysis and statistical principles
  • Semiconductor packaging and assembly technologies

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.


Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.



Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

Posted: 2022-05-05 Expires: 2022-06-05

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Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003

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