21 days old

Packaging Research and Development Engineer

Phoenix, AZ 85003
  • Job Code
Job Description

Become a part of Intel's Assembly and Test Technology Development (ATTD) Advance Packaging Team by joining the Mechanical and Process Core Competency (MPCC) team.

Join the Core Competency organization to assist in achieving our mission and continuing to make this a great place to work.

The MPCC team deals with fundamental process development challenges for advanced packaging technologies.

  • This team leverages both experimental and numerical methods across a broad range of areas, including thermal, mechanical, and fluids.
  • This position uses a combination of simulations and experiments, as needed, to help solve practical engineering problems.
  • The team has a specific need for expertise in laser-material interactions that occur during laser ablation, laser scribing, and pulsed laser deposition processes, and in particular, how to apply first principles to optimize various laser processes.

The ideal candidate should exhibit the following:

  • One or more years of practical experience with numerical and/or experimental characterization of laser-material interactions.
  • Apply experimental and numerical methods to solve practical engineering problems.
  • Communication skills, problem solving and analytical skills.

This is an entry level position and compensation will be given accordingly.


You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.

Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

  • Possess a master's degree with 6+ months of experience or PhD degree with 1+ years of experience in one of the following relevant science or engineering fields: Mechanical Engineering or Chemical Engineering or Materials Science or Physics or Chemistry, or related Engineering field.
  • Engineering programming skills in tools like MATLAB, Python, or similar.
  • Candidate must possess the degree by employment start date. 

Preferred Qualifications

6+ months of experience (master's) or 1+ years of experience (PhD) with one of the following:

  • Commercial Mechanical and/or CFD modeling tools like Comsol, Fluent, Ansys, or similar.
  • Designing, planning and executing experiments, along with interpretation of results.
  • Programming/script development with artificial intelligence and machine learning concepts.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Work Model for this Role

This role will require an on-site presence.

Posted: 2022-06-14 Expires: 2022-07-15

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Packaging Research and Development Engineer

Phoenix, AZ 85003

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