14 days old

Packaging Research and Development Engineer

Phoenix, AZ 85003
  • Job Code
Job Description

Assembly and Test Technology Development (ATTD) Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.

  • Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages.
  • Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design.
  • Conducts tests and research on basic materials and properties.
  • Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.
  • Provides consultation concerning packaging problems and improvements in the packaging process.
  • Responds to customer/client requests or events as they occur.
  • Develops solutions to problems utilizing formal education and judgment.

The candidate should also exhibit the following behavioral traits/skills:

  • Critical Thinking in failure analysis, root cause investigation, and DOE/FMEA creation.
  • Deal with ambiguity, collaborate and work in a team setting and curiosity to learn.

This is an entry level position and compensation will be given accordingly.


You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.

Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications

  • Possess a master's degree with 6+ months of experience or PhD degree with 1+ years of experience in Mechanical Engineering, Material Science or related fields.
  • Candidate must possess the degree by employment start date. 

6+ months of experience (master's) or 1+ years of experience (PhD) in one or more of the following:

  • Constitutive behavior and/or failure modeling of metallic, polymeric or composite materials.
  • Research at multiple material length scales Continuum/microstructural
  • FE software (Abaqus or Ansys or COMSOL etc.)
  • Programming and scripting (MATLAB or Python or Fortran etc.)
  • Multiple areas of Solid Mechanics (Continuum Mechanics or Elasticity, Fatigue or Fracture etc.)
  • Metals and polymeric material behavior and failure mechanisms.
  • Elastic, Inelastic and Fatigue behavior of metals and/or polymers.
  • Experimental techniques in solid mechanics.

Preferred Qualifications

6+ months of experience (master's) or 1+ years of experience (PhD) in one or more of the following:

  • Multiscale in composites/metals/polymers damage propagation (Reduced order methods)
  • Time-scaling for fatigue problems
  • Grain recrystallization or polycrystal plasticity.
  • Multiphysics modeling (Electro-mechanical/Thermo-mechanical/Fluid-structure)
  • Manufacturing process modeling (Electronic packaging assembly and reliability/Wafer level assembly)

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Other Locations

US, Oregon, Hillsboro

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

Posted: 2022-06-20 Expires: 2022-07-21

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Packaging Research and Development Engineer

Phoenix, AZ 85003

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