19 days old

Packaging Technology Development Engineer

Intel
Phoenix, AZ 85003
  • Job Code
    JR0206193
Job Description

Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.

  • Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages.

  • Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design.

  • Conducts tests and research on basic materials and properties.

  • Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.

  • Provides consultation concerning packaging problems and improvements in the packaging process.

  • Responds to customer/client requests or events as they occur.

  • Develops solutions to problems utilizing formal education and judgment.

What we offer: 

  • We give you opportunities to transform technology and create a better future, by delivering products that touch the lives of every person on earth. 

  • As a global leader in innovation and new technology, we foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. 

  • We offer a competitive salary and financial benefits such as bonuses, life and disability insurance, opportunities to buy Intel stock at a discounted rate, and Intel stock awards (eligibility at the discretion of Intel Corporation). 

  • We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and much more creative perks that make Intel a Great Place to Work! 

We're constantly working on making a more connected and intelligent future, and we need your help. Change tomorrow. Start today.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research, and relevant previous job and internship experience. This role is eligible for sponsorship.

Minimum Qualifications:

  • Possess a Masters or PhD degree in Mechanical Engineering/Materials Science Engineering/Chemical Engineering/Electrical Engineering or related field

  • +2 years of experience


Preferred Qualifications:

  • Integrated Technical Problem Solving with Factory Equipment, Assembly Material Sets and Key Process Parameters (KPP)

  • Developing Equipment and Process Recipe Development for Semiconductor Equipment

  • Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles used for Technical Problem Solving

  • Sustaining Semiconductor Process Steps in dynamic Operations Environment

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.


Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.



Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

Posted: 2022-05-05 Expires: 2022-06-05

Before you go...

Our free job seeker tools include alerts for new jobs, saving your favorites, optimized job matching, and more! Just enter your email below.

Share this job:

Packaging Technology Development Engineer

Intel
Phoenix, AZ 85003

Join us to start saving your Favorite Jobs!

Sign In Create Account
Powered ByCareerCast