Intel Silicon Photonics Product Division (SPPD) is at the forefront of silicon photonics integration and is part of The Connectivity Group which is at the heart of Intel's transformation from a PC company to a company that powers the cloud and billions of smart, connected computing-devices. Since announcing the world's first hybrid silicon laser nearly a decade ago, our team continues to lead the industry with cutting-edge technology and efficient, scalable high-volume manufacturing. Our dedication to advanced development ensures that Intel Silicon Photonics continues to drive future data center bandwidth growth with smaller form factors, co-packaging and higher speeds from 400G today to 1.6T+ and beyond tomorrow. We are looking for great talent to accelerate this journey so if you are interested in joining our leading organization then we want to hear from you.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Education Requirement:

- Masters in Chemical Engineering, Materials Science, Chemistry, Physics, Mechanical Engineering or Electrical Engineering with 8+ years of experience in packaging and assembly technology development and manufacturing introduction.

Minimum Qualifications:

- 6+ years of experience with the latest generation wafer processing and assembly technologies Wafer bumping and die prep, Flip Chip including Thermal Compression Bonding, Wire-bond, Heat Spreader Attach, Multichip packaging assembly, and the associated processes, materials, and equipment. 

Preferred Qualifications:

- 6+ years of experience on package assembly process equipment tools is a plus.

- 6+ years of experience on package design tools

- 8+ years of experience working both with internal teams as well as with external suppliers, and  Out Sourced Assembly and Test vendors (OSATs) to lead  development activities.

- 8+ years of experience with failure analysis and assembly metrology techniques.

- PhD in Chemical Engineering, Materials Science, Chemistry, Physics, Mechanical Engineering or Electrical Engineering with 10+ years of experience in packaging and assembly technology development and manufacturing introduction.

The Network & Edge Group brings together our network connectivity and edge into a business unit chartered to drive technology end to end product leadership. It's leadership Ethernet, Switch, IPU, Photonics, Network and Edge portfolio is comprised of leadership products critically important to our customers.

Other Locations

US, California, Santa Clara

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.