This position is for a wafer fabrication Process Engineer at Intel's Aloha Factory Operations (AFO) Far Back End (FBE) factory in Aloha, Oregon. The AFO FBE factory is an Intel wafer factory/fab that specializes in far back-end wafer fabrication (thin films deposition, lithography, etch, electroplating, etc.). In this role you will own process development, ramping processes to high volume manufacturing (HVM), and sustaining of leading-edge processes and tools.

As a Module Process Engineer at Intel, you will be responsible for identifying, responding to, and characterizing process tool and defect problems, implementing root cause solutions to those problems, and continuously improving your toolset's safety, quality, velocity, and cost performance. Responsibilities will include, but are not be limited to:

• Developing Intel's latest technologies and ramping these new technologies from process startup to high volume manufacturing.
• Working with Manufacturing and Yield departments to ensure AFO is the premier far back-end facility.
• Working towards maintaining multi-generation tool and process synergy through partnerships with other organizations.
• Interacting with partner factories worldwide to transfer new processes, maintain CE! (copy exactly) parameters, share learnings and drive improvements.
• Partnering with the Manufacturing Department to assist technicians with their technical development.

The ideal candidate should exhibit the following behavioral traits:

• Learn new processes and tools.
• Make technical decisions and provide technical direction.
• Listening, written, and verbal communication skills.
• Team building capability.

This is an entry level position and will be compensated accordingly.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Relevant experience can be obtained through school work, classes and project work, internships, military training, and/or work experience.

This position is not eligible for Intel immigration sponsorship.

Minimum Qualifications:

• Candidate must possess a Bachelor's or Master's degree in Mechanical Engineering, Chemical Engineering, Materials Science, Electrical Engineering, Physics, or related STEM fields.
• 3+ months of experience on wafer fabrication process or equipment. 

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.