Join our Intel 3D NAND Technology and manufacturing team as a Product Development Test Engineer and work on one of the most advanced Intel 3D NAND Technology and SSD technology portfolios in the world. This position gives a unique opportunity for the candidate to showcase leadership, hardware, software, and data-analysis skills. The candidate will be part of a dynamic team and a unique work culture. This is a high impact role, with a broad scope where the candidate will have clear ownership, accountability, and the deliverables will have direct visibility and impact to overall business.

The successful candidate will be responsible for, but not be limited to ensuring the testability and manufacturability of integrated circuits from feasibility through production ramp, and driving evaluations, development, and debug of complex test methods for new and exciting product generations including High Speed IO (HSIO) focused testing. You will engage in the testability and manufacturability of Intel 3D NAND Technology Flash components from the component feasibility stage through production ramp.

As a Intel 3D NAND Technology Product Test Development Engineer the candidate will be responsible for:
- Test development of next generation Intel 3D NAND Technology Memory Technology products.
- Ensure the testability and manufacturability of integrated circuits from feasibility stage through production ramp.
- Development, evaluation, debug of complex circuits and test programs.
- Development, testing, and qualification of new test hardware solutions.
- Collaborate with cross-functional teams such as Product Engineering,
- Design Engineering, Technology Development, and Process Engineering to resolve cross-functional problems.
- Driving cross-functional stakeholder consensus.
- Coming up with innovative solutions to drive Test Time Reduction and Yield improvement.

The ideal candidate should demonstrate:
- Team player enthusiastic about working in a collaborative, cross-functional, cross-site environment.
- Self-directed, analytical, and experienced in troubleshooting and resolving complex technical problems.
- Communication, technical presentation, problem solving skills.

The position is associated with the sale of the Intel 3D NAND Technology business to SK Hynix aligning to Phase 2 of the transaction. Employees aligned to Phase 2 will continue to be employed by Intel developing Intel 3D NAND Technology and components. Phase 2 of the transaction is expected to close in March 2025 at which time employees aligned to this phase of the transaction will transition employment to Solidigm, a stand-alone US subsidiary of SK Hynix headquartered in San Jose, California with offices world-wide. Solidigm is a leading global supplier of Intel 3D NAND Technology flash memory solutions, led by Robert (Rob) B. Crooke as CEO, previously senior vice president and general manager of Intel's Non-Volatile Memory Solutions Group. To read more, see: https://www.intc.com/news-events/press-releases/detail/1513/intel-sells-ssd-business-and-dalian-facility-to-sk-hynix

Qualifications

Minimum Qualifications:
The candidate must have a Bachelor's degree in Electrical Engineering, Computer Engineering or related field.
3+ years of experience in the following areas:
- Intel 3D NAND Technology , DRAM, Optane, SRAM, or NOR flash memory product development as a Product Engineer, Product Quality and Reliability Engineer, or in High Volume Test Engineer
- Programming (C/C++)
- Semiconductor devices and circuits
- Silicon debug, module development, content development, RTL simulations and Test Program Integration

Preferred Qualifications:

Master's degree in Electrical Engineering, Computer Engineering, or related field, plus 2+ years of experience.
- High Speed test methods and systems
- Experience with Input/Output operations, specifications, and debug
- Sort, class, system Test techniques, preferably of memory devices
- Data extraction and analysis
- Python scripting
- Git/Bitbucket/Agile methodology
- Semiconductor fabrication process flow, wafer test methodologies and reliability mechanisms

Employees in Intel's NAND Product Group deliver solutions that are transforming computing across all segments from data centers to Ultrabooks. They invent, develop, bring to market and support customers with leading-edge NAND flash memory and system level solutions such as solid state drives (SSDs). SSDs are accelerating performance for gaming enthusiasts, reducing total cost of ownership for IT managers of data centers and improving security and reliability for businesses. This dynamic group is strategically positioned to become the leading Non-Volatile Memory solution supplier for the compute segment and is a key to expanding markets and continuing the growth for Intel.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.