11 days old

Senior Assembly-Packaging Engineer

Intel
Santa Clara, CA 95050
  • Job Code
    JR0218163
Job Description

External Manufacturing Production (EMP) team is chartered with high volume manufacturing of Intel products with our 3rd party Foundry and OSAT suppliers.

Responsibilities may include, but not limited to:

  • Provide project management, package development and sustaining support for IC or semiconductor assemblies, various other electronic components and/or completed units.
  • Drive Assembly yield, quality and manufacturability projects working with internal assembly teams and OSATs.
  • Drive pareto detractors in BE (e.g., Chip-Package-Interaction, assembly, and package) modules. Drive CIPs with OSATs to ensure smooth ramp and HVM sustaining. Coordinate and lead focused task forces as needed.
  • Responsible for early engagement with TD/NPI development to ensure robust package quality, reliability and manufacturability.
  • Debug assembly process/ test/ product interactions to find solutions.
  • Drive implementation of process controls with OSATs to prevent excursions.
  • Centralize learning and standardize / deploy system and process in PVE and HVM.
  • Understand the assembly technology offering landscape, strengths and weaknesses, design rules/spec, material properties and participate in driving improvements.
  • Work collaboratively with multiple teams not only within the org but also from the BU engineering / NPI groups and key manufacturing partners to enhance yield and manufacturability.

A successful candidate will demonstrate:

  • Team player / facilitator. Works collaboratively with other teams and role models collaboration.
  • Influencer. Self-aware, active listener, and seeker of win/win solutions. Seeks to influence key thought leaders and deciders.
  • Communicator. Communicates clearly - visual, written, and verbal - across all levels at Intel. Values brevity and getting to the point.
  • Assertive. Works independently, develops a point of view, and advocates across Intel. Respects people and process while advocating.
  • Curiosity. Learns fast, derives trends from data, and drives solutions. Asks the great thought-provoking questions that drive action.
  • Passion. Person who enjoys Product Integration Engineering, Leadership and has an established track record of achieving excellent results through their team.
  • Experience in Chip-Package-Interaction risk assessment to evaluate downstream Assembly/Test performance with changes made at Front End design, process, and materials.

 


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. This Position is not eligible for Intel immigration sponsorship

Minimum Qualifications:

  • Candidate must possess at least a Bachelor's degree in Engineering or related field.
  • 3+ years of relevant experience in advance packaging assembly process and technology including 2.3D, 2.5D and 3D packaging.

Preferred Qualifications:

  • Master's degree or Ph.D. preferred.

Inside this Business Group

Intel's Sales and Marketing (SMG) organization works with global customers and partners to solve critical business problems with Intel based technology solutions. SMG works across business units to amplify the customer voice and deliver solutions that accelerate their business. We work across numerous industries, including retail, enterprise and government, cloud services and healthcare as examples. The operations team focuses on forecasting, driving alignment with factory production and delivering efficiency tools and our marketing capability drives demand and localized marketing in locations around the globe. Our sales force navigates a complex partner and customer ecosystem while shaping product roadmaps, driving value for our customers, and collaborating to harness emerging technology trends to deliver comprehensive solutions.



Other Locations

US, Arizona, Phoenix;US, Oregon, Portland


Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.



Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

Posted: 2022-05-15 Expires: 2022-06-15

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Senior Assembly-Packaging Engineer

Intel
Santa Clara, CA 95050

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