1 day old

Silicon Photonics Bonding Process Development Engineer

Albuquerque, NM 87102
  • Job Code
Job Description

As a Module Process Engineer at Intel, you will be responsible for identifying, responding to, and characterizing process tool and defect problems, implementing root cause solutions to those problems, and continuously improving your toolset's safety, quality, velocity, and cost performance.

Job duties include but not limited to:

  • Recommend process improvements by studying and determining applicability of latest bonding process advancements from industry and literature

  • Have an extensive grasp on the fundamentals of semiconductor bonding process and leverage this to explain downstream impacts and recommend process improvements from first principles

  • Understand impact of recipe changes to downstream processes, inline and end-of-line yields

  • Plan and conduct experiments to help characterize process through development cycle

  • Develop and create new Intellectual Property to advance the bonding process technology

  • Engage closely with tool vendors, drive resolution to any process and/or equipment problems methodically

  • Establish relationships across various departments to drive cohesive learning and cross functional problem solving

  • Working with a team of tool, process, yield, and product engineers to address performance and yield problems connected to process segment

The ideal candidate should exhibit the following behavioral traits:

  • Self-driven; demonstrates a strong sense of ownership in driving projects/tasks to completion while proactively managing stakeholders and maintaining quality in results delivered

  • Ability to collaborate and partner with internal and external suppliers and customers

  • Excellent communication in both written and verbal form when working with a variety of business organizations

  • Show flexibility and drive to accommodate changing priorities and business needs by supporting development and production roles as business needs evolve

  • Quick learner: demonstrate ability to learn working hands-on with process and metrology equipment in a fast-paced manufacturing environment.


Minimum Qualifications:
  • MS, or PhD in Electrical Engineering, Material Science, Physics, Mechanical Engineering, Microelectronics Engineering, or Chemical Engineering

  • 1+ years experience in semiconductor processing and material characterization in an academic or industrial setting

  • 1+ Experience with wafer-to-wafer or die-to-wafer hybrid bonding

Preferred Qualifications:

  • Demonstrated Experience working with optical/III-V materials

  • Demonstrated Experience with photonics device fabrication and characterization

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Work Model for this Role

This role is available as fully home-based and generally would require you to attend Intel sites only occasionally based on business need.

Posted: 2022-07-01 Expires: 2022-08-01

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Silicon Photonics Bonding Process Development Engineer

Albuquerque, NM 87102

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