Intel Silicon Photonics Product Division (SPPD) is at the forefront of silicon photonics integration and is part of the Connectivity Group which is at the heart of Intel's transformation from a PC company to a company that powers the cloud and billions of smart, connected computing-devices. Since announcing the world's first hybrid silicon laser nearly a decade ago, our team continues to lead the industry with cutting-edge technology and efficient, scalable high-volume manufacturing. Our dedication to advanced development ensures that Intel Silicon Photonics continues to drive future data center bandwidth growth with smaller form factors, co-packaging and higher speeds from 400G today to 1.6T+ and beyond tomorrow. We are looking for great talent to accelerate this journey so if you are interested in joining our leading organization then we want to hear from you.

This role is a leadership position towards development of the packaging technology for the next generation of Silicon Photonic products. Advanced packaging is a key enabler for these products which focus on Co-Packaging and Optical I/O. As part of our Silicon Photonics Division, you will be responsible for leading the package technology development towards realization of these new products.

Qualifications

You must possess the below education requirement and minimum qualifications to be initially considered for this position Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Education Requirement:

- Master's Degree in packaging related technical discipline and 6+ years industry experience.

Minimum Qualifications:
- 6+ years of experience in Technical Program Depth and Leadership for a complex multi-organizational project that also spans multiple geographies in the U.S. and Asia.
- 6+ years electronic chip assembly and packaging experience, both with some deep technical content as well as in a leadership capacity.
- 6+ years of experience in bringing together packaging technology, design, manufacturing, quality, supply chain, which would span teams both internal to Intel and with external suppliers.
- 6+ years of experience providing leadership to external material suppliers and assembly sites.

Preferred Qualifications:

- PhD in packaging related technical discipline and 6+ years industry experience.
- 6+ years of experience working Internationally and willingness for periodic travel.
- 6+ years of experience managing both technology depth and willing to abstract and effectively communicate and work with other stakeholders.
 

The Network & Edge Group brings together our network connectivity and edge into a business unit chartered to drive technology end to end product leadership. It's leadership Ethernet, Switch, IPU, Photonics, Network and Edge portfolio is comprised of leadership products critically important to our customers.

Other Locations

US, California, Santa Clara

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.