This position gives a unique opportunity for the candidate to showcase leadership, hardware, software, and data analysis skills. The candidate will be part of a dynamic team and a unique work culture. This is a high impact role, with a broad scope where the candidate will have clear ownership, accountability, and the deliverables will have direct visibility and impact to overall business.

As a Senior Product Engineer, you are responsible for improving and maintaining the HVM yields and help in bringing up new cutting-edge 3D NAND Technologies by working with brilliant team of engineers. You will be faced with complex problems in bringing up the technology and improving HVM yields, and are required to possess excellent problem-solving skills. You will be responsible for HVM yields on a given Technology and mentoring and instructing new engineers along the way. You will work hand in hand with several cross-functional teams such as Design, Process, Device Characterization, Reliability and Test Engineering teams in bringing up and qualifying the product and improving HVM yields, requiring excellent communication, multitasking and presentation skills.

As a NAND Sr Product Engineer, you are responsible for a wide variety of tasks in the NAND product life cycle, such as:
- Maintaining HVM Yields by addressing yield issues by working with several cross-functional teams.
- Develop and Validate Electrical counter measures and work on disposition for Fab excursions in HVM.

- Validate SWR's to facilitate data for Technology and Fab Teams in HVM.
- Validate All new Reticle updates in HVM for Yields and Quality.
- Working with design teams in developing solutions for Design for Manufacturability including new test modes for effective screens and stresses development simulations and validation of test modes and help debug design related issues.
- Ensure product specifications are met, working with design teams.
- Responsible for developing Wafer sort Probe tests, Test Time Reduction and Probe Yield Fab Yield improvement.
- Responsible for Electrical Failure Analysis and development of new stresses and screens for DPM improvement and yield improvement on the new upcoming technologies and yield sustainability on mature products.
- Work with several cross-functional teams for resolving product level issues.
- Data Analysis and Parsing skills to analysis high volume data for Quality improvement and Yield improvement.
- Analyzes and evaluates component specification versus performance to ensure optimal match of component requirements with production equipment capability, with specific emphasis on yield analysis.
- Responsible for product qualification.
- Work with cross-functional teams in resolving external customer related issues, including internal SSD qualifications.

This position is in the NAND-DTM Group, which is aligned to phase 2 of the sale of the Intel 3D NAND Technology business to Solidigm, a wholly owned subsidiary of SK Hynix. Employees in this business group will work on developing Intel 3D NAND Technology and components.  Phase 2 of the transaction is expected to close in March 2025 at which time employees aligned to this phase of the transaction will transition employment to Solidigm. Solidigm, a leading global supplier of Intel 3D NAND Technology flash memory solutions, is headquartered in San Jose, California with offices worldwide.

Qualifications

Qualifications:
You must possess the following minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates

Minimum Qualifications
- Bachelor's or Master's degree in Electrical or Computer Engineering or similar degree.
- 10+ years of experience working on nonvolatile memory component as a Sr. Product Engineer, Staff/Sr. Staff Engineer, Sr. Product QRE Engineer or in High Volume Manufacturing.
- 10+ years of experience in memory test or device characterization.
- Experience with basic 2D NAND or 3D NAND wafer Fabrication Process.

Preferred Qualifications
Experience in:

- Maintaining HVM yields by addressing HVM issues.
- High Volume data analytical skills and familiarity with any or all tools: Microsoft Excel, JMP, Python, Spotfire and Yield Cube.
- NAND Flash Memory architecture and NAND erase program and read algorithms.
- Electrical Failure Analysis, identifying root cause of the problems and developing counter measures.
- NAND Flash quality reliability mechanisms and NAND device physics.
- NAND Flash wafer and component level testing and yield improvement.
- NAND Flash to system integration.

Employees in Intel's NAND Product Group deliver solutions that are transforming computing across all segments from data centers to Ultrabooks. They invent, develop, bring to market and support customers with leading-edge NAND flash memory and system level solutions such as solid state drives (SSDs). SSDs are accelerating performance for gaming enthusiasts, reducing total cost of ownership for IT managers of data centers and improving security and reliability for businesses. This dynamic group is strategically positioned to become the leading Non-Volatile Memory solution supplier for the compute segment and is a key to expanding markets and continuing the growth for Intel.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.