18 days old

Substrate Pathfinding Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003
  • Job Code
    JR0214502
Job Description

Become a part of Intel's Advance Packaging Team by joining the Substrate Packaging Technology Development (SPTD) organization. Our mission is to be the supplier of choice for leading and affordable substrate packaging. Join the SPTD organization to assist in achieving our mission and continuing to make this a great place to work.

Packaging R and D Engineer defines and establishes process flow, procedures, and roadmaps for package substrate development. In this position, you will be in charge of substrate materials development for microelectronic packaging to meet quality, reliability, cost, yield, productivity and manufacturing requirements. Responsibilities include: researching and benchmarking on new substrate materials; developing new materials to enable next generation substrate for microelectronic packaging; innovating, problem solving, and continuously improving materials in substrate manufacturing; providing project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies; interacting with substrate and equipment suppliers, and international travel is required for project management and technical discussions with suppliers.

This is an entry level position and compensation will be given accordingly.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Knowledge and/or experience listed below would be obtained through a combination of your school work and/or classes and/or research and/or relevant previous job and/or internship experiences .

Minimum Qualifications:


- Candidate must possess a MS degree with 6+ months of experience or Ph.D. degree with 1+ years of experience in Materials Science and Engineering, Mechanical engineering, Chemical Engineering, Chemistry, or other applied engineering field.

Must have the required degree or expect the required degree by June 2022.


Preferred Qualifications:

1+ years of experience in the following:


- Demonstrate experience in polymerization, deformation of materials, and material development.
- Demonstrate experience in fundamentals of materials science and engineering.
- Demonstrate experience in handling analytical tools (such as SEM, FTIR, TMA, DMA, DSC, TGA, SIMS, and mechanical testing machines).
- Demonstrate experience in relationship between processing versus microstructure versus. mechanical and physical properties of materials (polymers, composites, metals and ceramics).
- Demonstrate experience in fracture and adhesion mechanisms of materials and material interfaces.
- Expertise desired includes magnetic and photosensitive materials formulation and characterization.
- High tolerance of ambiguity and flexibility in dealing with dynamic nature of project scope.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.


Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.



Work Model for this Role

This role is available as fully home-based and generally would require you to attend Intel sites only occasionally based on business need.

Posted: 2022-05-03 Expires: 2022-06-03

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Substrate Pathfinding Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003

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