The High-Density Modular Test team in Assembly and Test Technology Development designs, develops and provides a breakthrough massively parallel low-cost test technology for silicon validation and high-volume manufacturing.

We are currently looking for a System Software Engineer who will work on the tester platform for low-level software design and development.

Your responsibilities include but are not limited to:

• Work with others to design, develop, and maintain a hardware interface layer, including Windows USB (Universal Serial Bus) and PCIe (PCI Express) drivers.

• Debug and isolate complex issues throughout the stack, from hardware components to high level software.

• Review design schematics and documentation to ensure desired functionality can be achieved with a combination of hardware and software.

• Help drive and improve process standardization for productivity, efficiency, and quality.

The candidate should also exhibit the following behavioral traits and/or skills:

• Proficiency in solving technical problems and clear written and verbal communication skills.

Qualifications

You must meet the requirements below to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

• Must possess a bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field , +6 years' experience or master's degree, +4 years' experience or PhD +2 years experience

• 5+ years industry experience in driver design or low-level software design.

Preferred Qualifications:
Experience in one or more of the following:

• C/C++

• Windows Drivers

• Computer Architecture and OS (Operating System) internals

• Multi-threading and multi-processing

• Interfacing with USB microcontrollers

• Scripting Languages such as Python

• Interfaces such as I2C, SPI (Serial Peripheral Interfaces), PCIe, DDR (Double Data Rate), SERDES, and JTAG (Joint Test Action Group)

• Devices such as GPIO (General Purpose Input Output) expanders, clock generators, power/temperature monitoring ICs (Integrated Circuit), Analog-to-Digital (ADC) and Digital-to-Analog (DAC) converters

• BIOS (Basic Input Output System) and interactions between the BIOS and operating system

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.